Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443776 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2016-09-13 |
| 9287186 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2016-03-15 |
| 8466056 | Method of forming metal interconnect structures in ultra low-k dielectrics | Birendra Agarwala, Du Nguyen | 2013-06-18 |
| 8053257 | Method for prediction of premature dielectric breakdown in a semiconductor | Kaushik Chanda, Paul S. McLaughlin, Robert D. Edwards, Lawrence A. Clevenger, Andrew P. Cowley +2 more | 2011-11-08 |
| 7692439 | Structure for modeling stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2010-04-06 |
| 7639032 | Structure for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2009-12-29 |
| 7470613 | Dual damascene multi-level metallization | Birendra Agarwala, Eric M. Coker, Anthony Correale, Jr., Timothy D. Sullivan, Richard A. Wachnik | 2008-12-30 |
| 7397260 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2008-07-08 |
| 7388224 | Structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2008-06-17 |
| 7345305 | Control of liner thickness for improving thermal cycle reliability | Ronald G. Filippi, Lynne M. Gignac, Vincent J. McGahay, Conal E. Murray, Thomas M. Shaw +1 more | 2008-03-18 |
| 7279411 | Process for forming a redundant structure | Birendra Agarwala, Du Nguyen | 2007-10-09 |
| 7224063 | Dual-damascene metallization interconnection | Birendra Agarwala, Eric M. Coker, Anthony Correale, Jr., Timothy D. Sullivan, Richard A. Wachnik | 2007-05-29 |
| 7163883 | Edge seal for a semiconductor device | Birendra Agarwala, Hormazdyar M. Dalal, Eric G. Liniger, Diana Llera-Hurlburt, Du Nguyen +3 more | 2007-01-16 |
| 7138714 | Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal lines | Du Nguyen, Birendra Agarwala, Conrad A. Barile, Jawahar P. Nayak | 2006-11-21 |
| 7098054 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2006-08-29 |
| 6989282 | Control of liner thickness for improving thermal cycle reliability | Ronald G. Filippi, Lynne M. Gignac, Vincent J. McGahay, Conal E. Murray, Thomas M. Shaw +1 more | 2006-01-24 |
| 6972209 | Stacked via-stud with improved reliability in copper metallurgy | Birendra Agarwala, Conrad A. Barile, Hormazdyar M. Dalal, Brett H. Engle, Michael Lane +8 more | 2005-12-06 |
| 6825561 | Structure and method for eliminating time dependent dielectric breakdown failure of low-k material | Birendra Agarwala, Du Nguyen | 2004-11-30 |
| 6734090 | Method of making an edge seal for a semiconductor device | Birendra Agarwala, Hormazdyar M. Dalal, Eric G. Liniger, Diana Llera-Hurlburt, Du Nguyen +3 more | 2004-05-11 |
| 6348731 | Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same | Leon Ashley, Hormazdyar M. Dalal, Du Nguyen, Richard G. Smith | 2002-02-19 |
| 6294835 | Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof | Hormazdyar M. Dalal, Du Nguyen | 2001-09-25 |
| 6287954 | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity | Leon Ashley, Hormazdyar M. Dalal, Du Nguyen, Richard G. Smith | 2001-09-11 |
| 6258710 | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity | Hormazdyar M. Dalal, Paul S. McLaughlin, Du Nguyen, Richard G. Smith, Alexander J. Swinton +1 more | 2001-07-10 |
| 6133139 | Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof | Hormazdyar M. Dalal, Du Nguyen | 2000-10-17 |
| 6130161 | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity | Leon Ashley, Hormazdyar M. Dalal, Du Nguyen, Richard G. Smith | 2000-10-10 |