Issued Patents All Time
Showing 1–25 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154878 | Semiconductor device | Christoph Kutter, Ewald Soutschek | 2024-11-26 |
| 11848294 | Semiconductor device | Christoph Kutter, Ewald Soutschek | 2023-12-19 |
| 11322451 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Gottfried Beer, Magdalena Hoier | 2022-05-03 |
| 11233027 | Semiconductor device | Christoph Kutter, Ewald Soutschek | 2022-01-25 |
| 11195787 | Semiconductor device including an antenna | Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Dominic Maier +4 more | 2021-12-07 |
| 10854547 | Chip package with cross-linked thermoplastic dielectric | Joachim Mahler, Guenter Tutsch | 2020-12-01 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer +6 more | 2020-08-04 |
| 10679959 | Semiconductor device | Christoph Kutter, Ewald Soutschek | 2020-06-09 |
| 10600690 | Method for handling a product substrate and a bonded substrate system | Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol +1 more | 2020-03-24 |
| 10529678 | Semiconductor device | Christoph Kutter, Ewald Soutschek | 2020-01-07 |
| 10522447 | Chip package and a wafer level package | — | 2019-12-31 |
| 10297564 | Semiconductor die attach system and method | Joachim Mahler | 2019-05-21 |
| 10211158 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Gottfried Beer, Magdalena Hoier | 2019-02-19 |
| 10177112 | Attaching chip attach medium to already encapsulated electronic chip | Joachim Mahler, Edward Fuergut | 2019-01-08 |
| 10121690 | Method of manufacturing a semiconductor component and semiconductor component | Edward Fuergut, Joachim Mahler | 2018-11-06 |
| 10090216 | Semiconductor package with interlocked connection | Reinhard Pufall, Michael Goroll, Rainer Dudek | 2018-10-02 |
| 10056295 | Method for handling a product substrate, a bonded substrate system and a temporary adhesive | Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol +1 more | 2018-08-21 |
| 10049962 | Arrangement of multiple power semiconductor chips and method of manufacturing the same | Edward Fuergut, Joachim Mahler | 2018-08-14 |
| 9917036 | Chip package and a wafer level package | — | 2018-03-13 |
| 9748611 | Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery | Klaus Elian, Jochen Dangelmaier, Manfred Fries, Juergen Hoegerl, Thomas Mueller +3 more | 2017-08-29 |
| 9666499 | Semiconductor device with encapsulant | Joachim Mahler, Edward Fuergut, Khalil Hosseini | 2017-05-30 |
| 9627305 | Semiconductor module with interlocked connection | Reinhard Pufall, Michael Goroll, Rainer Dudek | 2017-04-18 |
| 9576867 | Device comprising a ductile layer and method of making the same | Reinhard Pufall | 2017-02-21 |
| 9425116 | Integrated circuit package and a method for manufacturing an integrated circuit package | Frank Daeche | 2016-08-23 |
| 9349709 | Electronic component with sheet-like redistribution structure | Juergen Hoegerl | 2016-05-24 |