Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406940 | Semiconductor chip having a crack stop structure | Sergey Ananiev, Andreas Bauer, Michael Goroll, Maria Heidenblut, Stefan Kaiser +3 more | 2025-09-02 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer +6 more | 2020-08-04 |
| 10090216 | Semiconductor package with interlocked connection | Georg Meyer-Berg, Michael Goroll, Rainer Dudek | 2018-10-02 |
| 9627305 | Semiconductor module with interlocked connection | Georg Meyer-Berg, Michael Goroll, Rainer Dudek | 2017-04-18 |
| 9576867 | Device comprising a ductile layer and method of making the same | Georg Meyer-Berg | 2017-02-21 |
| 9331019 | Device comprising a ductile layer and method of making the same | Georg Meyer-Berg | 2016-05-03 |
| 7183022 | Method for producing a mask set for lithography including at least one mask and methods for imaging structures of a predetermined layout into a common exposure plane | Molela Moukara | 2007-02-27 |
| 6993455 | Method for determining the construction of a mask for the micropatterning of semiconductor substrates by means of photolithography | Roderick Koehle | 2006-01-31 |