Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283535 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad | 2025-04-22 |
| 11984377 | IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad | 2024-05-14 |
| 11935808 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad | 2024-03-19 |
| 11935799 | Integrated circuit package lids with polymer features | Taylor Gaines, Frederick Atadana, Sergio Antonio Chan Arguedas, Robert F. Cheney | 2024-03-19 |
| 11923267 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad | 2024-03-05 |
| 11881440 | Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds | Marely E. Tejeda Ferrari, Taylor Gaines, James C. Matayabas, Jr. | 2024-01-23 |
| 11881438 | First-level integration of second-level thermal interface material for integrated circuit assemblies | Kyle Arrington, Sergio Antonio Chan Arguedas, Aravindha R. Antoniswamy | 2024-01-23 |
| 11869824 | Thermal interface structures for integrated circuit packages | Kyle Arrington, Aaron McCann, Kelly Lofgreen, Aravindha R. Antoniswamy, Joseph B. Petrini | 2024-01-09 |
| 11710672 | Microelectronic package with underfilled sealant | Taylor Gaines, Ken Hackenberg, Frederick Atadana | 2023-07-25 |
| 11710677 | Ultraviolet (UV)-curable sealant in a microelectronic package | Taylor Gaines, Ken Hackenberg | 2023-07-25 |
| 11004768 | Multi-chip package with partial integrated heat spreader | Muhammad Saiful Islam, Enisa Harris, Suzana Prstic, Sergio Antonio Chan Arguedas, Sachin Deshmukh +1 more | 2021-05-11 |
| 10569298 | Substrate with epoxy cured by ultraviolet laser | Michael Greenley | 2020-02-25 |
| 10475715 | Two material high K thermal encapsulant system | Venmathy McMahan, Sivakumar Nagarajan, Amrita Mallik, Kuang-Han Chu, Liwei Wang +3 more | 2019-11-12 |