Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11555801 | Operation of diagnostic devices involving microchannels and electrodes | Jaione Tirapu Azpiroz, Emmanuel Delamarche, Ricardo Luis Ohta, Mathias B. Steiner, Yuksel Temiz | 2023-01-17 |
| 11021646 | Nanoparticle design for enhanced oil recovery | Ronaldo Giro, Mathias B. Steiner | 2021-06-01 |
| 10766086 | Injection-molded solder (IMS) tool assembly and method of use thereof | Bonnie L Glick, Jae-Woong Nah | 2020-09-08 |
| 10444184 | Operation of diagnostic devices involving microchannels and electrodes | Jaione Tirapu Azpiroz, Emmanuel Delamarche, Ricardo Luis Ohta, Mathias B. Steiner, Yuksel Temiz | 2019-10-15 |
| 10392555 | Nanoparticle design for enhanced oil recovery | Ronaldo Giro, Mathias B. Steiner | 2019-08-27 |
| 10108762 | Tunable miniaturized physical subsurface model for simulation and inversion | Lior Horesh, Ulisses T. Mello, Maria J. B. Moura | 2018-10-23 |
| 10081015 | Trapping at least one microparticle | Jaione Tirapu Azpiroz, Emmanuel Delamarche, Yuksel Temiz | 2018-09-25 |
| 9962714 | Microchannel, microfluidic chip and method for processing microparticles in a fluid flow | Jaione Tirapu Azpiroz, Emmanuel Delamarche, Yuksel Temiz | 2018-05-08 |
| 9759643 | Method and integrated device for analyzing liquid flow and liquid-solid interface interaction | Phaedon Avouris, Michael Engel, Ronaldo Giro, Rodrigo Neumann Barros Ferreira, Mathias B. Steiner | 2017-09-12 |
| 9310285 | Method and integrated device for analyzing liquid flow and liquid-solid interface interaction | Phaedon Avouris, Michael Engel, Ronaldo Giro, Rodrigo Neumann Barros Ferreira, Mathias B. Steiner | 2016-04-12 |
| 8963340 | No flow underfill or wafer level underfill and solder columns | Michael A. Gaynes, Jae-Woong Nah, Da-Yuan Shih | 2015-02-24 |
| 8938627 | Multilayer securing structure and method thereof for the protection of cryptographic keys and code | Stefano S. Oggioni, Vincenzo Condorelli | 2015-01-20 |
| 8875978 | Forming constant diameter spherical metal balls | Peter A. Gruber, Mark H. McLeod, Jae-Woong Nah | 2014-11-04 |
| 8820612 | Injection molded solder process for forming solder bumps on substrates | Mark H. McLeod, Jae-Woong Nah, Eric D. Perfecto | 2014-09-02 |
| 8636931 | Vacuum extrusion method of manufacturing a thermal paste | Ijeoma M. Nnebe, Maurice McGlashan-Powell | 2014-01-28 |
| 8496159 | Injection molded solder process for forming solder bumps on substrates | Mark H. McLeod, Jae-Woong Nah, Eric D. Perfecto | 2013-07-30 |
| 8408448 | Forming constant diameter spherical metal balls | Peter A. Gruber, Mark H. McLeod, Jae-Woong Nah | 2013-04-02 |
| 8178153 | Heat transfer control structures using thermal phonon spectral overlap | Maurice McGlashan-Powell, Ijeoma M. Nnebe | 2012-05-15 |
| 7981849 | Reversible thermal thickening grease | Jeffrey D. Gelorme, Sushumna Iruvanti, Rajneesh Kumar, Ijeoma M. Nnebe | 2011-07-19 |
| 7951648 | Chip-level underfill method of manufacture | Nancy C. LaBianca | 2011-05-31 |
| 7815968 | Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation | Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon A. Casey, Matteo Flotta +5 more | 2010-10-19 |
| 7776993 | Underfilling with acid-cleavable acetal and ketal epoxy oligomers | Stephen L. Buchwalter, Gareth G. Hougham, Nancy C. LaBianca, Hosadurga Shobha | 2010-08-17 |
| 7773220 | Method and system for collecting alignment data from coated chips or wafers | Nancy C. LaBianca, Steven E. Steen | 2010-08-10 |
| 7768005 | Physically highly secure multi-chip assembly | Vincenzo Condorelli, Kevin C. Gotze, Nihad Hadzic, John U. Knickerbocker, Edmund J. Sprogis | 2010-08-03 |
| 7523852 | Solder interconnect structure and method using injection molded solder | Stephen L. Buchwalter, Peter A. Gruber, Sung Kwon Kang, Paul A. Lauro, Da-Yuan Shih | 2009-04-28 |