Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142509 | Electrostatic chuck with seal surface | Patrick Breiling, Michael Philip Roberts, Ishtak Karim, Adrien LaVoie, Ramesh Chandrasekharan | 2024-11-12 |
| 12110586 | Pedestals for modulating film properties in atomic layer deposition (ALD) substrate processing chambers | Adrien LaVoie, Michael Philip Roberts, Richard Phillips, Ramesh Chandrasekharan | 2024-10-08 |
| 12040181 | Modulated atomic layer deposition | Chan Myae Myae Soe, Shiva Sharan Bhandari, Pulkit Agarwal, Adrien LaVoie, Bart J. van Schravendijk | 2024-07-16 |
| 11959175 | Fill on demand ampoule refill | Tuan Nguyen, Eashwar Ranganathan, Shankar Swaminathan, Adrien LaVoie, Ramesh Chandrasekharan +2 more | 2024-04-16 |
| 11443975 | Planar substrate edge contact with open volume equalization pathways and side containment | Patrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie +7 more | 2022-09-13 |
| 11286560 | Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching | Richard Phillips, Nishanth Manjunath | 2022-03-29 |
| 11127567 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Shankar Swaminathan, Jun Qian, Frank L. Pasquale +8 more | 2021-09-21 |
| 11072860 | Fill on demand ampoule refill | Tuan Nguyen, Eashwar Ranganathan, Shankar Swaminathan, Adrien LaVoie, Ramesh Chandrasekharan +2 more | 2021-07-27 |
| 10697059 | Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching | Richard Phillips, Nishanth Manjunath | 2020-06-30 |
| 10665429 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Shankar Swaminathan, Jun Qian, Frank L. Pasquale +8 more | 2020-05-26 |
| 10648079 | Reducing backside deposition at wafer edge | Andrew Duvall, Ryan Blaquiere, Shankar Swaminathan | 2020-05-12 |
| 10622243 | Planar substrate edge contact with open volume equalization pathways and side containment | Patrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie +7 more | 2020-04-14 |
| 10541117 | Systems and methods for tilting a wafer for achieving deposition uniformity | Shankar Swaminathan, Pramod Subramonium, Frank L. Pasquale, Jeongseok Ha | 2020-01-21 |
| 10526700 | Hardware and process for film uniformity improvement | Purushottam Kumar, Hu Kang, Adrien LaVoie, Yi Chung Chiu, Frank L. Pasquale +5 more | 2020-01-07 |
| 10407773 | Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system | Adrien LaVoie, Hu Kang, Purushottam Kumar, Shankar Swaminathan, Jun Qian +1 more | 2019-09-10 |
| 10378107 | Low volume showerhead with faceplate holes for improved flow uniformity | Ramesh Chandrasekharan, Saangrut Sangplung, Shankar Swaminathan, Frank L. Pasquale, Hu Kang +6 more | 2019-08-13 |
| 10323323 | Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition | Ramesh Chandrasekharan, Jennifer O'Loughlin, Saangrut Sangplung, Shankar Swaminathan, Frank L. Pasquale +1 more | 2019-06-18 |
| 10134579 | Method for high modulus ALD SiO2 spacer | Shankar Swaminathan | 2018-11-20 |
| 10100407 | Hardware and process for film uniformity improvement | Purushottam Kumar, Hu Kang, Adrien LaVoie, Yi Chung Chiu, Frank L. Pasquale +5 more | 2018-10-16 |
| 9970108 | Systems and methods for vapor delivery in a substrate processing system | Jun Qian, Hu Kang, Purushottam Kumar, Heather Landis, Andrew Duvall +11 more | 2018-05-15 |
| 9920844 | Valve manifold deadleg elimination via reentrant flow path | Karl Leeser, Saangrut Sangplung, Shankar Swaminathan, Frank L. Pasquale, Ted Minshall +1 more | 2018-03-20 |
| 9793096 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Shankar Swaminathan, Jun Qian, Frank L. Pasquale +8 more | 2017-10-17 |
| 9698042 | Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge | Ted Minshall, Frank L. Pasquale, Shankar Swaminathan, Ramesh Chandrasekharan | 2017-07-04 |
| 9631276 | Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition | Ramesh Chandrasekharan, Jennifer O'Loughlin, Saangrut Sangplung, Shankar Swaminathan, Frank L. Pasquale +1 more | 2017-04-25 |
| 9624578 | Method for RF compensation in plasma assisted atomic layer deposition | Jun Qian, Frank L. Pasquale, Adrien LaVoie, Hu Kang, Shankar Swaminathan +7 more | 2017-04-18 |