Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11286560 | Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching | Richard Phillips, Chloe Baldasseroni | 2022-03-29 |
| 10697059 | Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching | Richard Phillips, Chloe Baldasseroni | 2020-06-30 |