Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching

Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching

US Patent 11286560 · Granted Mar 29, 2022

Estimated economic value: $185,675,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Geographically dispersed hybrid cloud cluster2025
Modulated atomic layer deposition2025
Electrostatic chuck with seal surface2024
Pedestals for modulating film properties in atomic layer deposition (ALD) substr2024
Pedestals for modulating film properties in atomic layer deposition (ALD) substr2024
Modulated atomic layer deposition2024
Fill on demand ampoule refill2024
Planar substrate edge contact with open volume equalization pathways and side co2022
Systems and methods for suppressing parasitic plasma and reducing within-wafer n2021
Fill on demand ampoule refill2021
Substrate processing chamber including conical surface for reducing recirculatio2020
Thickness compensation by modulation of number of deposition cycles as a functio2020