Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12415305 | Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes | Sheila F. Chopin, Nishant Lakhera | 2025-09-16 |
| 11787097 | Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes | Sheila F. Chopin, Nishant Lakhera | 2023-10-17 |
| 11581241 | Circuit modules with front-side interposer terminals and through-module thermal dissipation structures | Fernando A. Santos, Li Li, Fui Yee Lim, Lan Chu Tan | 2023-02-14 |
| 11056457 | Semiconductor device with bond wire reinforcement structure | Lan Chu Tan, Wai Yew Lo, Poh Leng Eu, Chin Teck Siong | 2021-07-06 |
| 9947614 | Packaged semiconductor device having bent leads and method for forming | Navas Khan Oratti Kalandar, Nishant Lakhera, Akhilesh Kumar Singh | 2018-04-17 |
| 9418929 | Integrated circuit with sewn interconnects | Weng Hoong Chan | 2016-08-16 |
| 9351407 | Method for forming multilayer device having solder filled via connection | — | 2016-05-24 |
| 9299675 | Embedded die ball grid array package | Navas Khan Oratti Kalandar, Kesvakumar V. C. Muniandy | 2016-03-29 |
| 9190355 | Multi-use substrate for integrated circuit | Weng Hoong Chan, Ly Hoon Khoo, Navas Khan Oratti Kalandar | 2015-11-17 |
| 9165862 | Semiconductor device with plated through holes | Ngak Thong Teo | 2015-10-20 |
| 9159682 | Copper pillar bump and flip chip package using same | Chee Seng Foong, Navas Khan Oratti Kalandar | 2015-10-13 |
| 9034694 | Embedded die ball grid array package | Navas Khan Oratti Kalandar, Kesvakumar V. C. Muniandy | 2015-05-19 |
| 9030000 | Mold cap for semiconductor device | Poh Leng Eu, Kai Yun Yow | 2015-05-12 |
| 9000570 | Semiconductor device with corner tie bars | Weng Hoong Chan, Ly Hoon Khoo | 2015-04-07 |
| 8933547 | Lead frame with power bar for semiconductor device | Jia Lin Yap, Yin Kheng Au, Ahmad Termizi Suhaimi, Seng Kiong Teng, Navas Khan Oratti Kalandar | 2015-01-13 |
| 8809078 | Solar powered IC chip | Teck Beng Lau, Wai Yew Lo, Chin Teck Siong | 2014-08-19 |
| 8802508 | Semiconductor device package | Burton J. Carpenter, Shufeng Zhao | 2014-08-12 |
| 8698288 | Flexible substrate with crimping interconnection | Navas Khan Oratti Kalandar, Sharon Huey Lin Tay | 2014-04-15 |
| 8643189 | Packaged semiconductor die with power rail pads | Navas Khan Oratti Kalandar, Lan Chu Tan | 2014-02-04 |
| 8338236 | Vented substrate for semiconductor device | — | 2012-12-25 |
| 8338828 | Semiconductor package and method of testing same | Teck Beng Lau, Vemal Raja Manikam | 2012-12-25 |
| 8237293 | Semiconductor package with protective tape | Tzu Ling Wong, Vemal Raja Manikam, Vittal Raja Manikam | 2012-08-07 |
| 8198143 | Mold and substrate for use with mold | Poh Leng Eu, Wai Keong Wong | 2012-06-12 |
| 8062424 | Method and apparatus for molding substrate | Vermal Raja Manikam, Vittal Raja Manikam | 2011-11-22 |
| 7956471 | Mold and substrate for use with mold | Poh Leng Eu, Wai Keong Wong | 2011-06-07 |