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CVD based metal/semiconductor OHMIC contact for high volume manufacturing applications |
Reza Arghavani, Jeffrey Marks |
2015-10-06 |
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Polishing apparatus with grooved subpad |
Steven M. Zuniga, Peter McReynolds, Erik S. Rondum, Henry H. Au, Gregory E. Menk +3 more |
2009-10-13 |
| 7429210 |
Materials for chemical mechanical polishing |
Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum +2 more |
2008-09-30 |
| 7179159 |
Materials for chemical mechanical polishing |
Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum +2 more |
2007-02-20 |
| 6855043 |
Carrier head with a modified flexible membrane |
Jianshe Tang, Brian J. Brown, Charles C. Garretson, Thomas H. Osterheld, Fred C. Redeker |
2005-02-15 |
| 6834777 |
Closed loop control over delivery of liquid material to semiconductor processing tool |
Thomas H. Osterheld, Michael W. Richter |
2004-12-28 |
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Methods and compositions for chemical mechanical polishing shallow trench isolation substrates |
Anand N. Iyer, Deepak Kumar, Thomas H. Osterheld, Wei-Yung Hsu, Yong Sik Kim +2 more |
2004-11-02 |
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Closed loop control over delivery of liquid material to semiconductor processing tool |
Thomas H. Osterheld, Michael W. Richter |
2003-05-13 |
| 6361405 |
Utility wafer for chemical mechanical polishing |
Jeffrey Drue David, Thomas H. Osterheld, Sidney P. Huey |
2002-03-26 |
| 6251001 |
Substrate polishing with reduced contamination |
Jay D. Pinson, II, Brian J. Brown, Thomas H. Osterheld, Doyle E. Bennett, Nitin Shah +1 more |
2001-06-26 |
| 6220941 |
Method of post CMP defect stability improvement |
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