Issued Patents All Time
Showing 26–50 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011503 | Direct-bonded optoelectronic interconnect for high-density integrated photonics | Rajesh Katkar | 2021-05-18 |
| 10928664 | Display substrate, method for manufacturing the same and display device | — | 2021-02-23 |
| 10923408 | Cavity packages | Shaowu Huang, Javier A. Delacruz, Rajesh Katkar, Belgacem Haba | 2021-02-16 |
| 10879210 | Bonded structures | Paul M. Enquist, Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2020-12-29 |
| 10879207 | Bonded structures | Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2020-12-29 |
| 10849240 | Contact structures with porous networks for solder connections, and methods of fabricating same | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2020-11-24 |
| 10790222 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Wael Zohni, Akash Agrawal | 2020-09-29 |
| 10790262 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2020-09-29 |
| 10748858 | High yield substrate assembly | Ilyas Mohammed, Masud Beroz | 2020-08-18 |
| 10658313 | Selective recess | Javier A. Delacruz, Rajesh Katkar, Shaowu Huang, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi | 2020-05-19 |
| 10629577 | Direct-bonded LED arrays and applications | Min Tao, Rajesh Katkar, Cyprian Emeka Uzoh | 2020-04-21 |
| 10623710 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Guilian Gao, Arkalgud R. Sitaram | 2020-04-14 |
| 10600761 | Nanoscale interconnect array for stacked dies | Bongsub Lee, Belgacem Haba, Sangil Lee | 2020-03-24 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2020-03-10 |
| 10586785 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Charles G. Woychik, Cyprian Emeka Uzoh | 2020-03-10 |
| 10546834 | Multi-chip modules formed using wafer-level processing of a reconstituted wafer | Rajesh Katkar | 2020-01-28 |
| 10546832 | Bonded structures | Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2020-01-28 |
| 10535564 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Hong Shen, Arkalgud R. Sitaram | 2020-01-14 |
| 10531574 | Contact structures with porous networks for solder connections, and methods of fabricating same | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2020-01-07 |
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2019-12-31 |
| 10522499 | Bonded structures | Paul M. Enquist, Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2019-12-31 |
| 10515926 | System and method for providing 3D wafer assembly with known-good-dies | Hong Shen, Guilian Gao | 2019-12-24 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2019-12-17 |
| 10490520 | Multichip modules and methods of fabrication | Rajesh Katkar, Hong Shen | 2019-11-26 |
| 10440822 | Interposers with electrically conductive features having different porosities | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2019-10-08 |