Issued Patents All Time
Showing 51–75 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431648 | Making electrical components in handle wafers of integrated circuit packages | Hong Shen, Rajesh Katkar | 2019-10-01 |
| 10396041 | High yield substrate assembly | Ilyas Mohammed, Masud Beroz | 2019-08-27 |
| 10332854 | Anchoring structure of fine pitch bva | Rajesh Katkar, Gabriel Z. Guevara, Xuan Li, Cyprian Emeka Uzoh, Guilian Gao | 2019-06-25 |
| 10325880 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Sangil Lee, Guilian Gao | 2019-06-18 |
| 10304803 | Nanoscale interconnect array for stacked dies | Bongsub Lee, Belgacem Haba, Sangil Lee | 2019-05-28 |
| 10283445 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Wael Zohni, Akash Agrawal | 2019-05-07 |
| 10217720 | Multi-chip modules formed using wafer-level processing of a reconstitute wafer | Rajesh Katkar | 2019-02-26 |
| 10204977 | Making electrical components in handle wafers of integrated circuit packages | Hong Shen, Rajesh Katkar | 2019-02-12 |
| 10178363 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Guilian Gao, Arkalgud R. Sitaram | 2019-01-08 |
| 10177114 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Sangil Lee, Guilian Gao | 2019-01-08 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2019-01-08 |
| 10163833 | Multichip modules and methods of fabrication | Rajesh Katkar, Hong Shen | 2018-12-25 |
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2018-07-03 |
| 10008652 | Light emitting diode device with reconstituted LED components on substrate | Eric Tosaya | 2018-06-26 |
| 10002844 | Bonded structures | Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2018-06-19 |
| 9953957 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Charles G. Woychik, Cyprian Emeka Uzoh | 2018-04-24 |
| 9947643 | Inverted optical device | Ilyas Mohammed, Masud Beroz | 2018-04-17 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2018-04-17 |
| 9905523 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Hong Shen, Arkalgud R. Sitaram | 2018-02-27 |
| 9888584 | Contact structures with porous networks for solder connections, and methods of fabricating same | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2018-02-06 |
| 9871019 | Flipped die stack assemblies with leadframe interconnects | Ashok S. Prabhu, Rajesh Katkar, Cyprian Emeka Uzoh | 2018-01-16 |
| 9865675 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh | 2018-01-09 |
| 9832887 | Micro mechanical anchor for 3D architecture | Ilyas Mohammed, Belgacem Haba | 2017-11-28 |
| 9831302 | Making electrical components in handle wafers of integrated circuit packages | Hong Shen, Rajesh Katkar | 2017-11-28 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram +2 more | 2017-11-21 |