CL

Chi-I Lang

IN Intermolecular: 60 patents #7 of 248Top 3%
Applied Materials: 22 patents #582 of 7,310Top 8%
NS Novellus Systems: 15 patents #49 of 780Top 7%
📍 Cupertino, CA: #86 of 6,989 inventorsTop 2%
🗺 California: #2,363 of 386,348 inventorsTop 1%
Overall (All Time): #15,357 of 4,157,543Top 1%
97
Patents All Time

Issued Patents All Time

Showing 76–97 of 97 patents

Patent #TitleCo-InventorsDate
7658790 Concentrated electroless solution for selective deposition of cobalt-based capping/barrier layers Alexander Gorer, Tony P. Chiang 2010-02-09
7629198 Methods for forming nonvolatile memory elements with resistive-switching metal oxides Nitin Kumar, Jinhong Tong, Tony P. Chiang, Prashant B. Phatak 2009-12-08
7582555 CVD flowable gap fill Judy H. Huang, Michael Barnes, Sunil Shanker 2009-09-01
7524735 Flowable film dielectric gap fill process Vishal Gauri, Raashina Humayun, Judy H. Huang, Michael Barnes, Sunil Shanker 2009-04-28
7514375 Pulsed bias having high pulse frequency for filling gaps with dielectric material Sunil Shanker 2009-04-07
7482245 Stress profile modulation in STI gap fill Jengyi Yu, Judy H. Huang 2009-01-27
7476621 Halogen-free noble gas assisted H2 plasma etch process in deposition-etch-deposition gap fill Minh Anh Nguyen, Wenxian Zhu, Judy H. Huang 2009-01-13
7465659 Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) Kang Sub Yim, Melissa M. Tam, Dian Sugiarto, Peter Wai-Man Lee, Li-Qun Xia 2008-12-16
7435684 Resolving of fluorine loading effect in the vacuum chamber Ratsamee Limdulpaiboon, Kan Quan Vo 2008-10-14
7381451 Strain engineering—HDP thin film with tensile stress for FEOL and other applications Ratsamee Limdulpaiboon, Cayetano Gonzalez 2008-06-03
7344996 Helium-based etch process in deposition-etch-deposition gap fill Wenxian Zhu, Ratsamee Limdulpaiboon, Judy H. Huang 2008-03-18
7211525 Hydrogen treatment enhanced gap fill Sunil Shanker, Sean Cox, Judy H. Huang, Minh Anh Nguyen, Ken Vo +1 more 2007-05-01
7157384 Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) Kang Sub Yim, Melissa M. Tam, Dian Sugiarto, Peter Wai-Man Lee, Li-Qun Xia 2007-01-02
7153787 CVD plasma assisted lower dielectric constant SICOH film Seon-Mee Cho, Peter Wai-Man Lee, Dian Sugiarto, Chen-An Chen, Li-Qun Xia +2 more 2006-12-26
6943127 CVD plasma assisted lower dielectric constant SICOH film Seon-Mee Cho, Peter Wai-Man Lee, Dian Sugiarto, Chen-An Chen, Li-Qun Xia +2 more 2005-09-13
6849562 Method of depositing a low k dielectric barrier film for copper damascene application Li-Qun Xia, Ping Xu, Louis Yang 2005-02-01
6838393 Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide Kang Sub Yim, Melissa M. Tam, Dian Sugiarto, Peter Wai-Man Lee, Li-Qun Xia 2005-01-04
6709715 Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds Shin-Puu Jeng, Yeming Jim Ma, Fong Chang, Peter Wai-Man Lee, David Cheung 2004-03-23
6486082 CVD plasma assisted lower dielectric constant sicoh film Seon-Mee Cho, Peter Wai-Man Lee, Dian Sugiarto, Chen-An Chen, Li-Qun Xia +2 more 2002-11-26
6413583 Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound Farhad Moghadam, David Cheung, Ellie Yieh, Li-Qun Xia, Wai-Fan Yau +4 more 2002-07-02
6107184 Nano-porous copolymer films having low dielectric constants Robert P. Mandal, David Cheung, Peter Wai-Man Lee 2000-08-22
6086952 Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer Yeming Jim Ma, Fong Chang, Peter Wai-Man Lee, Shin-Puu Jeng, David Cheung 2000-07-11