Issued Patents All Time
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892184 | Photobucket floor colors with selective grafting | Kevin Lin, James M. Blackwell, Rami Hourani, Eungnak Han | 2021-01-12 |
| 10892223 | Advanced lithography and self-assembled devices | Richard E. Schenker, Kevin Lin, Florian Gstrein, James M. Blackwell, Marie Krysak +6 more | 2021-01-12 |
| 10867853 | Subtractive plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects | Kevin Lin, Richard E. Schenker | 2020-12-15 |
| 10804141 | Damascene plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects | Kevin Lin, Richard E. Schenker | 2020-10-13 |
| 10796909 | Surface-aligned lithographic patterning approaches for back end of line (BEOL) interconnect fabrication | Kevin Lin, James M. Blackwell | 2020-10-06 |
| 10692757 | Means to decouple the diffusion and solubility switch mechanisms of photoresists | Marie Krysak, Paul A. Nyhus, Michael J. Leeson | 2020-06-23 |
| 10644113 | Quantum dot array devices | James S. Clarke, Ravi Pillarisetty, Jeanette M. Roberts, Hubert C. George, Nicole K. Thomas | 2020-05-05 |
| 10615117 | Self-aligned via | Kevin Lin, Rami Hourani, James M. Blackwell | 2020-04-07 |
| 10593627 | Doric pillar supported maskless airgap structure for capacitance benefit with unlanded via solution | Kanwal Jit Singh, Kevin Lin | 2020-03-17 |
| 10553532 | Structure and method to self align via to top and bottom of tight pitch metal interconnect layers | Richard E. Schenker, Manish Chandhok, Mauro J. Kobrinsky, Kevin Lin | 2020-02-04 |
| 10490416 | Structures and methods for improved lithographic processing | James M. Blackwell | 2019-11-26 |
| 10457548 | Integrating MEMS structures with interconnects and vias | Kevin Lin, Chytra Pawashe, Raseong Kim, Ian A. Young, Kanwal Jit Singh | 2019-10-29 |
| 10366950 | Bottom-up selective dielectric cross-linking to prevent via landing shorts | Kevin Lin, James M. Blackwell, Rami Hourani | 2019-07-30 |
| 10366903 | Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias | Kevin Lin, Alan M. Myers | 2019-07-30 |
| 10269623 | Image tone-reversal with a dielectric using bottom-up cross-linking for back end of line (BEOL) interconnects | James M. Blackwell, Rami Hourani | 2019-04-23 |
| 10269622 | Materials and deposition schemes using photoactive materials for interface chemical control and patterning of predefined structures | Rami Hourani, Michael J. Leeson, Todd R. Younkin, Eungnak Han | 2019-04-23 |
| 10109583 | Method for creating alternate hardmask cap interconnect structure with increased overlay margin | Manish Chandhok, Jasmeet S. Chawla, Florian Gstrein, Eungnak Han, Rami Hourani +3 more | 2018-10-23 |
| 9932671 | Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD) | James M. Blackwell, Patricio E. Romero, Scott B. Clendenning, Grant Kloster, Florian Gstrein +2 more | 2018-04-03 |
| 9793163 | Subtractive self-aligned via and plug patterning for back end of line (BEOL) interconnects | Florian Gstrein, Richard E. Schenker, Paul A. Nyhus, Charles H. Wallace, Hui Jae Yoo | 2017-10-17 |
| 9570349 | Non-lithographically patterned directed self assembly alignment promotion layers | Rami Hourani, Eungnak Han, James M. Blackwell | 2017-02-14 |
| 9553018 | Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects | Kevin Lin, Kanwal Jit Singh, Alan M. Myers, Richard E. Schenker | 2017-01-24 |
| 9548269 | Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects | Alan M. Myers, Kanwal Jit Singh, Jasmeet S. Chawla | 2017-01-17 |
| 9530688 | Directed self assembly of block copolymers to form vias aligned with interconnects | Paul A. Nyhus, Swaminathan Sivakumar | 2016-12-27 |
| 9530733 | Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regions | James M. Blackwell, Scott B. Clendenning, Florian Gstrein, Eungnak Han, Grant Kloster +3 more | 2016-12-27 |
| 9443922 | Metal-insulator-metal capacitor formation techniques | Mauro J. Kobrinsky, Michael C. Mayberry | 2016-09-13 |