Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916524 | Stacked dice systems | Jackson Chung Peng Kong, Kooi Chi Ooi, Ping Ping Ooi | 2021-02-09 |
| 10910325 | Integrated circuit packages with conductive element having cavities housing electrically connected embedded components | Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2021-02-02 |
| 10903155 | Vertical modular stiffeners for stacked multi-device packages | Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2021-01-26 |
| 10903142 | Micro through-silicon via for transistor density scaling | Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan, Wai Ling Lee | 2021-01-26 |
| 10886209 | Multiple-layer, self-equalizing interconnects in package substrates | Stephen H. Hall, Chaitanya Sreerama, Jackson Chung Peng Kong | 2021-01-05 |
| 10856407 | Transmission line design with routing-over-void compensation | Khang Choong Yong, Jackson Chung Peng Kong, Stephen H. Hall, Yun Rou Lim | 2020-12-01 |
| 10840177 | Interposer with flexible portion | Jackson Chung Peng Kong, Min Suet Lim, Tin Poay Chuah | 2020-11-17 |
| 10748854 | Stairstep interposers with integrated shielding for electronics packages | Hungying L. Lo | 2020-08-18 |
| 10734318 | Folded semiconductor package architectures and methods of assembling same | Jackson Chung Peng Kong, Khang Choong Yong, Yun Rou Lim | 2020-08-04 |
| 10734333 | Semiconductor package having inductive lateral interconnects | Jackson Chung Peng Kong, Khang Choong Yong, Howard L. Heck | 2020-08-04 |
| 10716209 | Fiber weave-sandwiched differential pair routing technique | Eng Huat Goh, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim | 2020-07-14 |
| 10651127 | Ring-in-ring configurable-capacitance stiffeners and methods of assembling same | Jackson Chung Peng Kong, Kooi Chi Ooi, Paik Wen Ong | 2020-05-12 |
| 10652999 | Mutual inductance suppressor for crosstalk immunity enhancement | Khang Choong Yong, Jackson Chung Peng Kong, Stephen H. Hall | 2020-05-12 |
| 10643983 | Extended stiffener for platform miniaturization | Eng Huat Goh, Jackson Chung Peng Kong, Min Suet Lim, Khang Choong Yong, Howe Yin Loo | 2020-05-05 |
| 10633898 | Micro-hinge for an electronic device | Howe Yin Loo, Min Suet Lim, Jackson Chung Peng Kong, Poh Tat Oh | 2020-04-28 |
| 10606316 | Flexible computing device that includes a plurality of displays | Jackson Chung Peng Kong, Kooi Chi Ooi, Eng Huat Goh | 2020-03-31 |
| 10593618 | Packaged die stacks with stacked capacitors and methods of assembling same | Mooi Ling Chang, Ping Ping Ooi, Jackson Chung Peng Kong, Wen Wei Lum | 2020-03-17 |
| 10580761 | Systems in packages including wide-band phased-array antennas and methods of assembling same | Jackson Chung Peng Kong, Boon Ping Koh, Kooi Chi Ooi | 2020-03-03 |
| 10541200 | Over-molded IC packages with embedded voltage reference plane and heater spreader | Ping Ping Ooi, Jackson Chung Peng Kong, Mooi Ling Chang, Wen Wei Lum | 2020-01-21 |
| 10504854 | Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same | Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2019-12-10 |
| 10503211 | Multi-orientation display device | Chee Chun Yee, David W. Browning, Jackson Chung Peng Kong, Min Suet Lim, Howe Yin Loo +1 more | 2019-12-10 |
| 10484231 | Routing-over-void-T-line-compensation | Khang Choong Yong, Jackson Chung Peng Kong, Stephen H. Hall, Yun Rou Lim | 2019-11-19 |
| 10403604 | Stacked package assembly with voltage reference plane | Jackson Chung Peng Kong, Ping Ping Ooi, Kooi Chi Ooi, Shanggar Periaman | 2019-09-03 |
| 10396038 | Flexible packaging architecture | Jackson Chung Peng Kong, Shanggar Periaman, Michael P. Skinner, Yen Hsiang Chew, Kheng Tat MAR +2 more | 2019-08-27 |
| 10396047 | Semiconductor package with package components disposed on a package substrate within a footprint of a die | Jenny Shio Yin Ong, Jackson Chung Peng Kong, Seok Ling Lim | 2019-08-27 |