BC

Bok Eng Cheah

IN Intel: 136 patents #113 of 30,777Top 1%
📍 Merang, MY: #1 of 119 inventorsTop 1%
Overall (All Time): #7,530 of 4,157,543Top 1%
136
Patents All Time

Issued Patents All Time

Showing 76–100 of 136 patents

Patent #TitleCo-InventorsDate
10916524 Stacked dice systems Jackson Chung Peng Kong, Kooi Chi Ooi, Ping Ping Ooi 2021-02-09
10910325 Integrated circuit packages with conductive element having cavities housing electrically connected embedded components Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong 2021-02-02
10903155 Vertical modular stiffeners for stacked multi-device packages Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim 2021-01-26
10903142 Micro through-silicon via for transistor density scaling Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan, Wai Ling Lee 2021-01-26
10886209 Multiple-layer, self-equalizing interconnects in package substrates Stephen H. Hall, Chaitanya Sreerama, Jackson Chung Peng Kong 2021-01-05
10856407 Transmission line design with routing-over-void compensation Khang Choong Yong, Jackson Chung Peng Kong, Stephen H. Hall, Yun Rou Lim 2020-12-01
10840177 Interposer with flexible portion Jackson Chung Peng Kong, Min Suet Lim, Tin Poay Chuah 2020-11-17
10748854 Stairstep interposers with integrated shielding for electronics packages Hungying L. Lo 2020-08-18
10734318 Folded semiconductor package architectures and methods of assembling same Jackson Chung Peng Kong, Khang Choong Yong, Yun Rou Lim 2020-08-04
10734333 Semiconductor package having inductive lateral interconnects Jackson Chung Peng Kong, Khang Choong Yong, Howard L. Heck 2020-08-04
10716209 Fiber weave-sandwiched differential pair routing technique Eng Huat Goh, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim 2020-07-14
10651127 Ring-in-ring configurable-capacitance stiffeners and methods of assembling same Jackson Chung Peng Kong, Kooi Chi Ooi, Paik Wen Ong 2020-05-12
10652999 Mutual inductance suppressor for crosstalk immunity enhancement Khang Choong Yong, Jackson Chung Peng Kong, Stephen H. Hall 2020-05-12
10643983 Extended stiffener for platform miniaturization Eng Huat Goh, Jackson Chung Peng Kong, Min Suet Lim, Khang Choong Yong, Howe Yin Loo 2020-05-05
10633898 Micro-hinge for an electronic device Howe Yin Loo, Min Suet Lim, Jackson Chung Peng Kong, Poh Tat Oh 2020-04-28
10606316 Flexible computing device that includes a plurality of displays Jackson Chung Peng Kong, Kooi Chi Ooi, Eng Huat Goh 2020-03-31
10593618 Packaged die stacks with stacked capacitors and methods of assembling same Mooi Ling Chang, Ping Ping Ooi, Jackson Chung Peng Kong, Wen Wei Lum 2020-03-17
10580761 Systems in packages including wide-band phased-array antennas and methods of assembling same Jackson Chung Peng Kong, Boon Ping Koh, Kooi Chi Ooi 2020-03-03
10541200 Over-molded IC packages with embedded voltage reference plane and heater spreader Ping Ping Ooi, Jackson Chung Peng Kong, Mooi Ling Chang, Wen Wei Lum 2020-01-21
10504854 Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong 2019-12-10
10503211 Multi-orientation display device Chee Chun Yee, David W. Browning, Jackson Chung Peng Kong, Min Suet Lim, Howe Yin Loo +1 more 2019-12-10
10484231 Routing-over-void-T-line-compensation Khang Choong Yong, Jackson Chung Peng Kong, Stephen H. Hall, Yun Rou Lim 2019-11-19
10403604 Stacked package assembly with voltage reference plane Jackson Chung Peng Kong, Ping Ping Ooi, Kooi Chi Ooi, Shanggar Periaman 2019-09-03
10396038 Flexible packaging architecture Jackson Chung Peng Kong, Shanggar Periaman, Michael P. Skinner, Yen Hsiang Chew, Kheng Tat MAR +2 more 2019-08-27
10396047 Semiconductor package with package components disposed on a package substrate within a footprint of a die Jenny Shio Yin Ong, Jackson Chung Peng Kong, Seok Ling Lim 2019-08-27