Issued Patents All Time
Showing 101–125 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354957 | Electrical interconnect for a flexible electronic package | Jackson Chung Peng Kong, Stephen H. Hall, Khang Choong Yong, Kooi Chi Ooi, Eric C Gantner | 2019-07-16 |
| 10334736 | Flexible integrated circuit that includes an antenna | Boon Ping Koh | 2019-06-25 |
| 10319698 | Microelectronic device package having alternately stacked die | Min Suet Lim, Jackson Chung Peng Kong | 2019-06-11 |
| 10158339 | Capacitive compensation structures using partially meshed ground planes | Jackson Chung Peng Kong, Khang Choong Yong, Howard L. Heck, Wil Choon Song | 2018-12-18 |
| 10153253 | Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus | Howe Yin Loo, Eng Huat Goh, Min Suet Lim, Jackson Chung Peng Kong, Khang Choong Yong | 2018-12-11 |
| 10083922 | Inductor interconnect | Min Suet Lim, Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Jackson Chung Peng Kong +1 more | 2018-09-25 |
| 10085342 | Microelectronic device having an air core inductor | Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim, Chin Lee Kuan, Howe Yin Loo | 2018-09-25 |
| 10079158 | Vertical trench routing in a substrate | Jackson Chung Peng Kong, Khang Choong Yong, Howard L. Heck, Kuan-Yu Chen | 2018-09-18 |
| 10041282 | Micro-hinge for an electronic device | Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh | 2018-08-07 |
| 10036187 | Micro-hinge for an electronic device | Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh | 2018-07-31 |
| 10014710 | Foldable fabric-based packaging solution | Jackson Chung Peng Kong, Kooi Chi Ooi, Mark A. Schaecher, Teong Guan Yew, Eng Huat Goh | 2018-07-03 |
| 9893444 | Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices | Jackson Chung Peng Kong, Eng Huat Goh, Su Sin Florence Phun, Khang Choong Yong, Min Keen Tang | 2018-02-13 |
| 9839134 | Flexible integrated circuit that includes an antenna | Boon Ping Koh | 2017-12-05 |
| 9812422 | Embedded die-down package-on-package device | Toong Erh Ooi, Nitesh Nimkar | 2017-11-07 |
| 9812425 | Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same | Shanggar Periaman, Kooi Chi Ooi, Jackson Chung Peng Kong | 2017-11-07 |
| 9778688 | Flexible system-in-package solutions for wearable devices | Jiamiao Tang, Junfeng Zhao, Michael P. Skinner, Yong She, Jiun Hann Sir +3 more | 2017-10-03 |
| 9721878 | High density second level interconnection for bumpless build up layer (BBUL) packaging technology | Shanggar Periaman, Kooi Chi Ooi | 2017-08-01 |
| 9646953 | Integrated circuit packaging techniques and configurations for small form-factor or wearable devices | Jackson Chung Peng Kong, Kooi Chi Ooi, Shanggar Periaman, Michael P. Skinner | 2017-05-09 |
| 9552995 | Electrical interconnect for an electronic package | Khang Choong Yong, Teong Keat Beh, Howard L. Heck, Jackson Chung Peng Kong, Stephen H. Hall +1 more | 2017-01-24 |
| D773452 | Electronic device with flexible hinge | Howe Yin Loo, Min Suet Lim, Jackson Chung Peng Kong, Poh Tat Oh | 2016-12-06 |
| 9478524 | Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same | Shanggar Periaman, Kooi Chi Ooi, Jackson Chung Peng Kong | 2016-10-25 |
| 9455218 | Embedded die-down package-on-package device | Toong Erh Ooi, Nitesh Nimkar | 2016-09-27 |
| D759029 | Computer on a stick | Howe Yin Loo, Greg LA TOUR, Chan Kim Lee, Khai Ern See, Han Kung Chua +2 more | 2016-06-14 |
| 9360896 | Low-profile hinge for an electronic device | Min Suet Lim, Howe Yin Loo, Jackson Chung Peng Kong, Poh Tat Oh | 2016-06-07 |
| D756349 | Portable computing device with low profile hinge | Min Suet Lim, Howe Yin Loo, Jackson Chung Peng Kong, Poh Tat Oh | 2016-05-17 |