Issued Patents All Time
Showing 126–136 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136251 | Method to enable controlled side chip interconnection for 3D integrated packaging system | Shanggar Periaman, Kooi Chi Ooi, Jackson Chung Peng Kong | 2015-09-15 |
| 8987896 | High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same | Shanggar Periaman, Kooi Chi Ooi | 2015-03-24 |
| 8697495 | Stacked die package | Shanggar Periaman, Kooi Chi Ooi, Yen Hsiang Chew | 2014-04-15 |
| 8281229 | Firmware verification using system memory error check logic | Yen Hsiang Chew, Kooi Chi Ooi, Shanggar Periaman | 2012-10-02 |
| 8198716 | Die backside wire bond technology for single or stacked die package | Shanggar Periaman, Kooi Chi Ooi, Yen Hsiang Chew | 2012-06-12 |
| 8110930 | Die backside metallization and surface activated bonding for stacked die packages | Shanggar Periaman, Kooi Chi Ooi, Yen Hsiang Chew | 2012-02-07 |
| 8044497 | Stacked die package | Shanggar Periaman, Kooi Chi Ooi, Yen Hsiang Chew | 2011-10-25 |
| 7773504 | Bandwidth allocation for network packet traffic | Yen Hsiang Chew, Shanggar Periaman, Kooi Chi Ooi | 2010-08-10 |
| 7743181 | Quality of service (QoS) processing of data packets | Yen Hsiang Chew, Shanggar Periaman, Kooi Chi Ooi | 2010-06-22 |
| 7692278 | Stacked-die packages with silicon vias and surface activated bonding | Shanggar Periaman, Kooi Chi Ooi | 2010-04-06 |
| 7400033 | Package on package design to improve functionality and efficiency | Shanggar Periaman, Kooi Chi Ooi | 2008-07-15 |