Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649531 | Process for forming a damascene structure | Timothy J. Dalton, Prakash Dev, Daniel C. Edelstein, Scott D. Halle, Gill Yong Lee +1 more | 2003-11-18 |
| 6548901 | Cu/low-k BEOL with nonconcurrent hybrid dielectric interface | Timothy J. Dalton, Daniel C. Edelstein, Stephen M. Gates | 2003-04-15 |
| RE38029 | Wafer polishing and endpoint detection | Michael A. Leach | 2003-03-11 |
| 6483172 | Semiconductor device structure with hydrogen-rich layer for facilitating passivation of surface states | Donna R. Cote, Son V. Nguyen, Markus Kirchhoff, Max G. Levy, Manfred Hauf | 2002-11-19 |
| 6375693 | Chemical-mechanical planarization of barriers or liners for copper metallurgy | Daniel C. Edelstein, Naftali E. Lustig | 2002-04-23 |
| 6348076 | Slurry for mechanical polishing (CMP) of metals and use thereof | Donald F. Canaperi, Paul M. Feeney, Mahadevaiyer Krishnan, Joyce C. Liu, Michael F. Lofaro +2 more | 2002-02-19 |
| 6093508 | Dual damascene structure formed in a single photoresist film | — | 2000-07-25 |
| 5906911 | Process of forming a dual damascene structure in a single photoresist film | — | 1999-05-25 |
| 5753303 | Process for the elimination of tungsten oxidation with inert gas stabilization in chemical vapor deposition processes | Donna R. Cote, Donna D. Miura, Christopher J. Waskiewicz | 1998-05-19 |
| 5593537 | Apparatus for processing semiconductor wafers | James Ryan, Katsuya Okumura, Hiroyuki Yano | 1997-01-14 |
| 5558563 | Method and apparatus for uniform polishing of a substrate | Michael F. Lofaro | 1996-09-24 |
| 5534106 | Apparatus for processing semiconductor wafers | James Ryan, Katsuya Okumura, Hiroyuki Yano | 1996-07-09 |
| 5308438 | Endpoint detection apparatus and method for chemical/mechanical polishing | John Cronin, William R. Hill, Cheryl A. Hoffman | 1994-05-03 |
| 5262354 | Refractory metal capped low resistivity metal conductor lines and vias | Pei-Ing Lee, Thomas E. Sandwick, Bernd Vollmer, Victor Vynorius, Stuart H. Wolff | 1993-11-16 |
| 5234868 | Method for determining planarization endpoint during chemical-mechanical polishing | — | 1993-08-10 |
| 4956313 | Via-filling and planarization technique | Carter W. Kaanta, Michael A. Leach, James Paulsen | 1990-09-11 |
| 4919750 | Etching metal films with complexing chloride plasma | Robert C. Bausmith, John Cronin, Karey Holland, Carter W. Kaanta, Pei-Ing Lee +1 more | 1990-04-24 |
| 4910155 | Wafer flood polishing | Michael A. Leach | 1990-03-20 |
| 4838991 | Process for defining organic sidewall structures | Donald M. Kenney, Michael L. Kerbaugh, Michael A. Leach, Jeffrey A. Robinson, Robert W. Sweetser | 1989-06-13 |
| 4786360 | Anisotropic etch process for tungsten metallurgy | Karey Holland, Terrance M. Wright | 1988-11-22 |