Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426241 | Method for forming three-dimensional circuitization and circuits formed | Steven A. Cordes, Peter A. Gruber, James L. Speidell, Wayne J. Howell | 2002-07-30 |
| 6380063 | Raised wall isolation device with spacer isolated contacts and the method of so forming | Juan A. Chediak, Kurt R. Kimmel, Alain Loiseau, Randy W. Mann, Jed H. Rankin | 2002-04-30 |
| 6368881 | Wafer thickness control during backside grind | Donald W. Brouillette, Harold G. Linde, Michael S. Hibbs, Ronald L. Mendelson | 2002-04-09 |
| 6300687 | Micro-flex technology in semiconductor packages | Claude L. Bertin, Wayne J. Howell, John A. Fifield | 2001-10-09 |
| 6294406 | Highly integrated chip-on-chip packaging | Claude L. Bertin, Wayne J. Howell, Edmund J. Sprogis | 2001-09-25 |
| 6271102 | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof | Donald W. Brouillette, Robert F. Cook, Wayne J. Howell, Eric G. Liniger, Ronald L. Mendelson | 2001-08-07 |
| 6265771 | Dual chip with heat sink | Wayne J. Howell, Edmund J. Sprogis | 2001-07-24 |
| 6231333 | Apparatus and method for vacuum injection molding | Peter A. Gruber, Egon Max Kummer, Bernie Hernandez, Arthur R. Zingher | 2001-05-15 |
| 6225699 | Chip-on-chip interconnections of varied characteristics | Wayne J. Howell, Edmund J. Sprogis | 2001-05-01 |
| 6221775 | Combined chemical mechanical polishing and reactive ion etching process | William Francis Landers, Michael MacDonald, Walter E. Mlynko, Mark P. Murray, Kirk D. Peterson | 2001-04-24 |
| 6030855 | Self-aligned connector for stacked chip module | Claude L. Bertin, Wayne J. Howell | 2000-02-29 |
| 5977640 | Highly integrated chip-on-chip packaging | Claude L. Bertin, Wayne J. Howell, Edmund J. Sprogis | 1999-11-02 |
| 5972765 | Use of deuterated materials in semiconductor processing | William F. Clark, Jr., Terence B. Hook, Dale W. Martin | 1999-10-26 |
| 5935763 | Self-aligned pattern over a reflective layer | Michael Caterer, Timothy H. Daubenspeck, Edmund J. Sprogis | 1999-08-10 |
| 5926029 | Ultra fine probe contacts | Wayne J. Howell | 1999-07-20 |
| 5904502 | Multiple 3-dimensional semiconductor device processing method and apparatus | — | 1999-05-18 |
| 5903045 | Self-aligned connector for stacked chip module | Claude L. Bertin, Wayne J. Howell | 1999-05-11 |
| 5793103 | Insulated cube with exposed wire lead | Timothy H. Daubenspeck, Steven J. Holmes | 1998-08-11 |
| 5609772 | Cube maskless lead open process using chemical mechanical polish/lead-tip expose process | Timothy H. Daubenspeck, Steven J. Holmes | 1997-03-11 |
| 5244143 | Apparatus and method for injection molding solder and applications thereof | Peter A. Gruber, Bernardo Hernandez, Michael J. Palmer, Arthur R. Zingher | 1993-09-14 |