Issued Patents All Time
Showing 51–67 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7087997 | Copper to aluminum interlayer interconnect using stud and via liner | Lloyd Burrell, Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee +6 more | 2006-08-08 |
| 7037824 | Copper to aluminum interlayer interconnect using stud and via liner | Lloyd Burrell, Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee +6 more | 2006-05-02 |
| 7015150 | Exposed pore sealing post patterning | Edward C. Cooney, III, John A. Fitzsimmons, Jeffrey P. Gambino, Thomas L. McDevitt, Lee M. Nicholson +1 more | 2006-03-21 |
| 6762108 | Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed | Jeffrey P. Gambino, Thomas L. McDevitt, Henry W. Trombley | 2004-07-13 |
| 6504203 | Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed | Jeffrey P. Gambino, Thomas L. McDevitt, Henry W. Trombley | 2003-01-07 |
| 6426557 | Self-aligned last-metal C4 interconnection layer for Cu technologies | Timothy H. Daubenspeck, William T. Motsiff | 2002-07-30 |
| 6251787 | Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing | Daniel C. Edelstein, Wilma Jean Horkans, Naftall E. Lustig, Keith R. Pope, Peter D. Roper | 2001-06-26 |
| 6153043 | Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing | Daniel C. Edelstein, Wilma Jean Horkans, Naftali E. Lustig, Keith R. Pope, Peter D. Roper | 2000-11-28 |
| 5985762 | Method of forming a self-aligned copper diffusion barrier in vias | Robert M. Geffken | 1999-11-16 |
| 5731246 | Protection of aluminum metallization against chemical attack during photoresist development | Paul E. Bakeman, Jr., Hyun Koo Lee | 1998-03-24 |
| 5654221 | Method for forming semiconductor chip and electronic module with integrated surface interconnects/components | John Cronin, Steven H. Voldman | 1997-08-05 |
| 5521434 | Semiconductor chip and electronic module with integrated surface interconnects/components | John Cronin, Steven H. Voldman | 1996-05-28 |
| 5486267 | Method for applying photoresist | Stephen E. Knight, Thomas L. McDevitt | 1996-01-23 |
| 5480748 | Protection of aluminum metallization against chemical attack during photoresist development | Paul E. Bakeman, Jr., Hyun Koo Lee | 1996-01-02 |
| 5384281 | Non-conformal and oxidizable etch stops for submicron features | Donald M. Kenney | 1995-01-24 |
| 5219788 | Bilayer metallization cap for photolithography | John R. Abernathey, Timothy H. Daubenspeck, Denis J. Poley, Rosemary A. Previti-Kelly, Gary P. Viens +1 more | 1993-06-15 |
| 4944682 | Method of forming borderless contacts | John Cronin, Susan Cronin, Carter W. Kaanta, Charles W. Koburger, III, Dale J. Pearson | 1990-07-31 |