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Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, David A. Decrosta, Robert Lomenick +1 more |
2015-02-03 |
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Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, David A. Decrosta, Robert Lomenick +1 more |
2014-02-18 |
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Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, David A. Decrosta, Robert Lomenick +1 more |
2013-10-29 |
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Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, David A. Decrosta, Robert Lomenick +1 more |
2012-09-25 |
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Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, David A. Decrosta, Robert Lomenick +1 more |
2010-09-14 |
| 7482254 |
Apparatus and methods for thermally processing undoped and lightly doped substrates without pre-heating |
— |
2009-01-27 |
| 7224074 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, David A. Decrosta, Robert Lomenic +1 more |
2007-05-29 |
| 7005369 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, David A. Decrosta, Robert Lomenick +1 more |
2006-02-28 |
| 5952160 |
Method and system for controlling the relative size of images formed in light-sensitive media |
Albert S. Bergendahl |
1999-09-14 |
| 5943254 |
Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes |
Claude L. Bertin, Erik L. Hedberg, James M. Leas, Steven H. Voldman |
1999-08-24 |
| 5930098 |
Multichip semiconductor structures with interchip electrostatic discharge protection, and fabrication methods therefore |
Steven H. Voldman |
1999-07-27 |
| 5764342 |
Method and system for controlling the relative size of images formed in light-sensitive media |
Albert S. Bergendahl |
1998-06-09 |
| 5731246 |
Protection of aluminum metallization against chemical attack during photoresist development |
Hyun Koo Lee, Stephen E. Luce |
1998-03-24 |
| 5703747 |
Multichip semiconductor structures with interchip electrostatic discharge protection, and fabrication methods therefore |
Steven H. Voldman |
1997-12-30 |
| 5635285 |
Method and system for controlling the relative size of images formed in light-sensitive media |
Albert S. Bergendahl |
1997-06-03 |
| 5556802 |
Method of making corrugated vertical stack capacitor (CVSTC) |
Bomy Chen, John Cronin, Steven J. Holmes, Hing Wong |
1996-09-17 |
| 5480748 |
Protection of aluminum metallization against chemical attack during photoresist development |
Hyun Koo Lee, Stephen E. Luce |
1996-01-02 |
| 5347153 |
Short channel transistors |
— |
1994-09-13 |
| 5226732 |
Emissivity independent temperature measurement systems |
James S. Nakos, Dale P. Hallock, Jerome B. Lasky, Scott L. Pennington |
1993-07-13 |
| 4622573 |
CMOS contacting structure having degeneratively doped regions for the prevention of latch-up |
Henry J. Geipel, Jr. |
1986-11-11 |
| 4506436 |
Method for increasing the radiation resistance of charge storage semiconductor devices |
Robert Quinn |
1985-03-26 |
| 4369072 |
Method for forming IGFET devices having improved drain voltage characteristics |
Andres G. Fortino, Henry J. Geipel, Jr., Jeffrey P. Kasold, Robert Quinn |
1983-01-18 |