| 8946912 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Paul E. Bakeman, Jr., David A. Decrosta, Robert Lomenick +1 more |
2015-02-03 |
| 8652960 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Paul E. Bakeman, Jr., David A. Decrosta, Robert Lomenick +1 more |
2014-02-18 |
| 8569896 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Paul E. Bakeman, Jr., David A. Decrosta, Robert Lomenick +1 more |
2013-10-29 |
| 8274160 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Paul E. Bakeman, Jr., David A. Decrosta, Robert Lomenick +1 more |
2012-09-25 |
| 7795130 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Paul E. Bakeman, Jr., David A. Decrosta, Robert Lomenick +1 more |
2010-09-14 |
| 7224074 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Paul E. Bakeman, Jr., David A. Decrosta, Robert Lomenic +1 more |
2007-05-29 |
| 7005369 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Paul E. Bakeman, Jr., David A. Decrosta, Robert Lomenick +1 more |
2006-02-28 |
| 6617646 |
Reduced substrate capacitance high performance SOI process |
— |
2003-09-09 |
| 6403447 |
Reduced substrate capacitance high performance SOI process |
— |
2002-06-11 |
| 5846374 |
Gas agitated liquid etcher |
Mark A. Salsbery |
1998-12-08 |