Active area bonding compatible high current structures

Assignee

• Intersil Americas

Inventors

• John T. Gasner (24 patents)
• Michael D. Church (45 patents)
• Sameer D. Parab (10 patents)
• Paul E. Bakeman, Jr. (22 patents)
• David A. Decrosta (12 patents)
• Robert Lomenic (2 patents)
• Chris A. McCarty (12 patents)

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