| 8946912 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more |
2015-02-03 |
| 8652960 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more |
2014-02-18 |
| 8569896 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more |
2013-10-29 |
| 8274160 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more |
2012-09-25 |
| 7795130 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more |
2010-09-14 |
| 7224074 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenic +1 more |
2007-05-29 |
| 7181306 |
Enhanced plasma etch process |
— |
2007-02-20 |
| 7005369 |
Active area bonding compatible high current structures |
John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more |
2006-02-28 |
| 6130172 |
Radiation hardened dielectric for EEPROM |
Robert T. Fuller, Howard L. Evans, Michael Morrison, Robert K. Lowry |
2000-10-10 |
| 5837603 |
Planarization method by use of particle dispersion and subsequent thermal flow |
Jack H. Linn, John J. Hackenberg |
1998-11-17 |
| 5808353 |
Radiation hardened dielectric for EEPROM |
Robert T. Fuller, Howard L. Evans, Michael Morrison, Robert K. Lowry |
1998-09-15 |
| 5279850 |
Gas phase chemical reduction of metallic branding layer of electronic circuit package for deposition of branding ink |
Jack H. Linn, Martin Walter |
1994-01-18 |
