Robert K. Lowry has been granted 19 US patents while listed as an inventor at Harris . The first was granted in 1981 and the most recent in February 2013. Robert K. Lowry ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list Robert K. Lowry in Melbourne Beach, FL, US.
Patents per Year Patents granted per year, 1981 to 2013 Bar chart with a peak of 3 patents in 1998. peak 3 1981: 1 patents 1981 1988: 1 patents 1989: 1 patents 1989 1994: 1 patents 1995: 1 patents 1995 1996: 2 patents 1998: 3 patents 1998 2000: 2 patents 2002: 2 patents 2002 2005: 1 patents 2007: 1 patents 2007 2008: 1 patents 2011: 1 patents 2011 2013: 1 patents 2013
Issued Patents All Time
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Showing 1–19 of 19 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
RE43980 Laser decapsulation method — 2013-02-05
RE42193 Laser decapsulation method — 2011-03-01
7316936 Laser decapsulation method — 2008-01-08
7166186 Laser decapsulation apparatus and method — 2007-01-23
$13,246,000
6909146 Bonded wafer with metal silicidation Jack H. Linn , George V. Rouse , James F. Buller 2005-06-21
6457506 Decapsulating method and apparatus for integrated circuit packages — 2002-10-01
$26,737,000
6335208 Laser decapsulation method — 2002-01-01
6130172 Radiation hardened dielectric for EEPROM Robert T. Fuller , Howard L. Evans , Michael Morrison , David A. Decrosta 2000-10-10
6054012 Decapsulating method and apparatus for integrated circuit packages — 2000-04-25
5849627 Bonded wafer processing with oxidative bonding Jack H. Linn , George V. Rouse , James F. Buller 1998-12-15
$9,461,000
5808353 Radiation hardened dielectric for EEPROM Robert T. Fuller , Howard L. Evans , Michael Morrison , David A. Decrosta 1998-09-15
$2,039,000
5728624 Bonded wafer processing Jack H. Linn , Geroge V. Rouse , James F. Buller , William H. Speece 1998-03-17
$6,046,000
5569620 Bonded wafer processing with metal silicidation Jack H. Linn , George V. Rouse , James F. Buller 1996-10-29
$3,128,000
5517047 Bonded wafer processing Jack H. Linn , George V. Rouse , James F. Buller , William H. Speece 1996-05-14
$3,241,000
5387555 Bonded wafer processing with metal silicidation Jack H. Linn , George V. Rouse , James F. Buller 1995-02-07
$8,452,000
5362667 Bonded wafer processing Jack H. Linn , George V. Rouse , James F. Buller , William H. Speece 1994-11-08
$4,048,000
4859280 Method of etching silicon by enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions Edward U. Adams 1989-08-22
$1,535,000
4781853 Method of enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions Edward U. Adams 1988-11-01
$6,381,000
4272986 Method and means for measuring moisture content of hermetic semiconductor devices Larry A. Miller 1981-06-16
$2,118,000
