RL

Robert K. Lowry

Harris: 10 patents #123 of 2,288Top 6%
IA Intersil Americas: 9 patents #120 of 468Top 30%
Overall (All Time): #240,461 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
RE43980 Laser decapsulation method 2013-02-05
RE42193 Laser decapsulation method 2011-03-01
7316936 Laser decapsulation method 2008-01-08
7166186 Laser decapsulation apparatus and method 2007-01-23
6909146 Bonded wafer with metal silicidation Jack H. Linn, George V. Rouse, James F. Buller 2005-06-21
6457506 Decapsulating method and apparatus for integrated circuit packages 2002-10-01
6335208 Laser decapsulation method 2002-01-01
6130172 Radiation hardened dielectric for EEPROM Robert T. Fuller, Howard L. Evans, Michael Morrison, David A. Decrosta 2000-10-10
6054012 Decapsulating method and apparatus for integrated circuit packages 2000-04-25
5849627 Bonded wafer processing with oxidative bonding Jack H. Linn, George V. Rouse, James F. Buller 1998-12-15
5808353 Radiation hardened dielectric for EEPROM Robert T. Fuller, Howard L. Evans, Michael Morrison, David A. Decrosta 1998-09-15
5728624 Bonded wafer processing Jack H. Linn, Geroge V. Rouse, James F. Buller, William H. Speece 1998-03-17
5569620 Bonded wafer processing with metal silicidation Jack H. Linn, George V. Rouse, James F. Buller 1996-10-29
5517047 Bonded wafer processing Jack H. Linn, George V. Rouse, James F. Buller, William H. Speece 1996-05-14
5387555 Bonded wafer processing with metal silicidation Jack H. Linn, George V. Rouse, James F. Buller 1995-02-07
5362667 Bonded wafer processing Jack H. Linn, George V. Rouse, James F. Buller, William H. Speece 1994-11-08
4859280 Method of etching silicon by enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions Edward U. Adams 1989-08-22
4781853 Method of enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions Edward U. Adams 1988-11-01
4272986 Method and means for measuring moisture content of hermetic semiconductor devices Larry A. Miller 1981-06-16