Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonded wafer processing with oxidative bonding

Bonded wafer processing with oxidative bonding

US Patent 5849627 · Granted Dec 15, 1998

Estimated economic value: $9,461,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Metal capacitor design for improved reliability and good electrical connection2017
Semiconductor device comprising a buried poly resistor2015
Electronic device and method of biasing2014
Charging protection device2013
Transistor with asymmetric silicon germanium source region2013
Laser decapsulation method2013
Metal capacitor design for improved reliability and good electrical connection2013
Semiconductor devices with improved local matching and end resistance of RX base2012
Integrated circuit system with triode2012
Semiconductor device and methods for fabricating same2011
Charging protection device2011
Semiconductor device with transistor-based fuses and related programming method2011