Issued Patents All Time
Showing 26–50 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8421126 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more | 2013-04-16 |
| 8284017 | Structure having substantially parallel resistor material lengths | Mark C. Hakey, James S. Nakos | 2012-10-09 |
| 8236683 | Conductor structure including manganese oxide capping layer | Jeffrey P. Gambino | 2012-08-07 |
| 8232190 | Three dimensional vertical E-fuse structures and methods of manufacturing the same | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Anthony K. Stamper | 2012-07-31 |
| 8211728 | Horizontal micro-electro-mechanical-system switch | Anthony K. Stamper | 2012-07-03 |
| 8111129 | Resistor and design structure having substantially parallel resistor material lengths | Mark C. Hakey, James S. Nakos | 2012-02-07 |
| 8044764 | Resistor and design structure having resistor material length with sub-lithographic width | Mark C. Hakey, James S. Nakos | 2011-10-25 |
| 8026606 | Interconnect layers without electromigration | Thomas L. McDevitt, Anthony K. Stamper | 2011-09-27 |
| 8013342 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more | 2011-09-06 |
| 8004289 | Wafer-to-wafer alignments | Thomas Joseph Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Edmund J. Sprogis | 2011-08-23 |
| 7989312 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more | 2011-08-02 |
| 7977200 | Charge breakdown avoidance for MIM elements in SOI base technology and method | William F. Clark, Jr. | 2011-07-12 |
| 7884475 | Conductor structure including manganese oxide capping layer | Jeffrey P. Gambino | 2011-02-08 |
| 7824961 | Stacked imager package | James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Robert K. Leidy, Richard J. Rassel +1 more | 2010-11-02 |
| 7781781 | CMOS imager array with recessed dielectric | James W. Adkisson, Jeffrey P. Gambino, Zhong-Xiang He, Mark D. Jaffe, Robert K. Leidy +2 more | 2010-08-24 |
| 7670927 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more | 2010-03-02 |
| 7585758 | Interconnect layers without electromigration | Thomas L. McDevitt, Anthony K. Stamper | 2009-09-08 |
| 7541679 | Exposed pore sealing post patterning | Edward C. Cooney, III, John A. Fitzsimmons, Jeffrey P. Gambino, Thomas L. McDevitt, Lee M. Nicholson +1 more | 2009-06-02 |
| 7521798 | Stacked imager package | James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Robert K. Leidy, Richard J. Rassel +1 more | 2009-04-21 |
| 7521336 | Crack stop for low K dielectrics | Timothy H. Daubenspeck, Jeffrey P. Gambino, Thomas L. McDevitt, William T. Motsiff, Mark J. Pouliot +1 more | 2009-04-21 |
| 7474104 | Wafer-to-wafer alignments | Thomas Joseph Dalton, Jeffrey P. Gambino, Mark David Jaffee, Edmund J. Sprogis | 2009-01-06 |
| 7361989 | Stacked imager package | James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Robert K. Leidy, Richard J. Rassel +1 more | 2008-04-22 |
| 7335577 | Crack stop for low K dielectrics | Timothy H. Daubenspeck, Jeffrey P. Gambino, Thomas L. McDevitt, William T. Motsiff, Mark J. Pouliot +1 more | 2008-02-26 |
| 7193423 | Wafer-to-wafer alignments | Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Edmund J. Sprogis | 2007-03-20 |
| 7183656 | Bilayer aluminum last metal for interconnects and wirebond pads | Thomas L. McDevitt, Anthony K. Stamper | 2007-02-27 |