SN

Shreesh Narasimha

IBM: 102 patents #541 of 70,183Top 1%
Globalfoundries: 10 patents #365 of 4,424Top 9%
TE Tessera: 2 patents #162 of 271Top 60%
GU Globalfoundries U.S.: 1 patents #344 of 665Top 55%
📍 Beacon, NY: #2 of 281 inventorsTop 1%
🗺 New York: #418 of 115,490 inventorsTop 1%
Overall (All Time): #10,914 of 4,157,543Top 1%
115
Patents All Time

Issued Patents All Time

Showing 101–115 of 115 patents

Patent #TitleCo-InventorsDate
7456115 Method for forming semiconductor devices having reduced gate edge leakage current Anthony I. Chou 2008-11-25
7446062 Device having dual etch stop liner and reformed silicide layer and related methods Dureseti Chidambarrao, Ying Li, Rajeev Malik 2008-11-04
7446395 Device having dual etch stop liner and protective layer Dureseti Chidambarrao, Ying Li, Rajeev Malik 2008-11-04
7348635 Device having enhanced stress state and related methods Dureseti Chidambarrao, Ying Li, Rajeev Malik, Haining Yang, Huilong Zhu 2008-03-25
7329923 High-performance CMOS devices on hybrid crystal oriented substrates Bruce B. Doris, Kathryn Guarini, Meikei Ieong, Kern Rim, Jeffrey W. Sleight +1 more 2008-02-12
7306983 Method for forming dual etch stop liner and protective layer in a semiconductor device Dureseti Chidambarrao, Ying Li, Rajeev Malik 2007-12-11
7274072 Hybrid bulk-SOI 6T-SRAM cell for improved cell stability and performance Leland Chang, Norman J. Rohrer, Jeffrey W. Sleight 2007-09-25
7227204 Structure for improved diode ideality Edward P. Maciejewski, Sherry A. Womack, Christopher D. Sheraw 2007-06-05
7202187 Method of forming sidewall spacer using dual-frequency plasma enhanced CVD Ravikumar Ramachandran, James T. Kelliher, Jeffrey W. Sleight 2007-04-10
7189644 CMOS device integration for low external resistance Patricia A. O'Neil 2007-03-13
7091128 Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs Atul Ajmera, Andres Bryant, Percy V. Gilbert, Michael A. Gribelyuk, Edward P. Maciejewski +1 more 2006-08-15
7071072 Forming shallow trench isolation without the use of CMP Renee T. Mo 2006-07-04
7001844 Material for contact etch layer to enhance device performance Ashima B. Chakravarti, Victor Chan, Judson R. Holt, Satya N. Chakravarti 2006-02-21
6991979 Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs Atul Ajmera, Andres Bryant, Percy V. Gilbert, Michael A. Gribelyuk, Edward P. Maciejewski +1 more 2006-01-31
6825102 Method of improving the quality of defective semiconductor material Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana 2004-11-30