Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9662830 | Bondline control fixture and method of affixing first and second components | Tymon Barwicz, Nicolas Boyer, Stephane Harel, Roch Thivierge | 2017-05-30 |
| 9658415 | Structured substrate for optical fiber alignment | Russell A. Budd | 2017-05-23 |
| 9656420 | Bondline control fixture and method of affixing first and second components | Tymon Barwicz, Nicolas Boyer, Stephane Harel, Roch Thivierge | 2017-05-23 |
| 9651747 | Fiber pigtail assembly with integrated lid enabling optical fiber mobility | Tymon Barwicz, Nicolas Boyer, Alexander Janta-Polczynski | 2017-05-16 |
| 9577361 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Benjamin V. Fasano, Hilton T. Toy | 2017-02-21 |
| 9568682 | Component and chip assembly structure for high yield parallelized fiber assembly | Tymon Barwicz, Nicolas Boyer, Alexander Janta-Polczynski, Stephan L. Martel, Jean-Francois Morissette | 2017-02-14 |
| 9400356 | Fiber pigtail with integrated lid | Tymon Barwicz, Ted Lichoulas | 2016-07-26 |
| 9393633 | Method of joining a chip on a substrate | Pascal Blais, Kang-Wook Lee, Jae-Woong Nah, Soojae Park, Robert L. Toutant +1 more | 2016-07-19 |
| 9360644 | Laser die and photonics die package | Benjamin V. Fasano | 2016-06-07 |
| 9316796 | Fiber pigtail with integrated lid | Tymon Barwicz, Ted Lichoulas | 2016-04-19 |
| 9293439 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Marcus E. Interrante, Roger Lam +4 more | 2016-03-22 |
| 9246592 | Structured substrate for optical fiber alignment | Russell A. Budd | 2016-01-26 |
| 9243784 | Semiconductor photonic package | Tymon Barwicz, Stephane Harel, Yurii A. Vlasov | 2016-01-26 |
| 9206965 | Semiconductor photonic package | Tymon Barwicz, Stephane Harel, Yurii A. Vlasov | 2015-12-08 |
| 9093563 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Marcus E. Interrante, Roger Lam +4 more | 2015-07-28 |
| 8559474 | Silicon carrier optoelectronic packaging | Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano +4 more | 2013-10-15 |
| 8483253 | 3D optoelectronic packaging | Russell A. Budd, Frank R. Libsch | 2013-07-09 |
| 8411719 | 3D optoelectronic packaging | Russell A. Budd, Frank R. Libsch | 2013-04-02 |
| 8290008 | Silicon carrier optoelectronic packaging | Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano +4 more | 2012-10-16 |
| 8198133 | Structures and methods to improve lead-free C4 interconnect reliability | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter +1 more | 2012-06-12 |
| 8111730 | 3D optoelectronic packaging | Russell A. Budd, Frank R. Libsch | 2012-02-07 |
| 6822875 | Assembly of opto-electronic module with improved heat sink | Benson Chan, Ladd W. Freitag, Gary T. Galli, Francois Guindon, Glen Walden Johnson +3 more | 2004-11-23 |
| 6712527 | Fiber optic connections and method for using same | Benson Chan, Mitchell S. Cohen, Ladd W. Freitag, Richard R. Hall, Glen Walden Johnson +2 more | 2004-03-30 |
| 6652159 | Enhanced optical transceiver arrangement | Benson Chan, Francois Guindon, Glen Walden Johnson, Joseph Kuczynski, Gerald Daniel Malagrino, Jr. +3 more | 2003-11-25 |
| 6547452 | Alignment systems for subassemblies of overmolded optoelectronic modules | Benson Chan, Francois Guindon, Glen Walden Johnson, Martial Letourneau, John H. Sherman +1 more | 2003-04-15 |