Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6686539 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Donald S. Farquhar, Claudius Feger, Voya R. Markovich, Konstantinos I. Papathomas, Jane M. Shaw +2 more | 2004-02-03 |
| 6645607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Donald S. Farquhar, Konstantinos I. Papathomas | 2003-11-11 |
| 6613413 | Porous power and ground planes for reduced PCB delamination and better reliability | Robert M. Japp | 2003-09-02 |
| 6600224 | Thin film attachment to laminate using a dendritic interconnection | Donald S. Farquhar, Raymond T. Galasco, Sung Kwon Kang, Chandrika Prasad, Roy Yu | 2003-07-29 |
| 6581280 | Method for filling high aspect ratio via holes in electronic substrates | Brian E. Curcio, Peter A. Gruber, Frederic Maurer, Konstantinos I. Papathomas | 2003-06-24 |
| 6534179 | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use | Robert M. Japp, Konstantinos I. Papathomas | 2003-03-18 |
| 6534160 | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Donald S. Farquhar, Konstantinos I. Papathomas | 2003-03-18 |
| 6465084 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Donald S. Farquhar, Konstantinos I. Papathomas | 2002-10-15 |
| 6452117 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Brian E. Curcio, Peter A. Gruber, Frederic Maurer, Konstantinos I. Papathomas | 2002-09-17 |
| 6387205 | Dustfree prepreg and method for making an article based thereon | Bernd Karl Appelt, William Thomas Fotorny, Robert M. Japp, Kostantinos Papathomas | 2002-05-14 |
| 6351030 | Electronic package utilizing protective coating | Ross Downey Havens, Robert M. Japp, Jeffrey Alan Knight, Anne Marie Quinn | 2002-02-26 |
| 6329603 | Low CTE power and ground planes | Robert M. Japp | 2001-12-11 |
| 6254972 | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Donald S. Farquhar, Konstantinos I. Papathomas | 2001-07-03 |
| 6207595 | Laminate and method of manufacture thereof | Bernd Karl Appelt, Lawrence Robert Blumberg, William Thomas Fotorny, Ross Downey Havens, Robert M. Japp +3 more | 2001-03-27 |
| 6080684 | Dustfree prepreg and method for making an article based thereon | Bernd Karl Appelt, William Thomas Fotorny, Robert M. Japp, Kostantinos Papathomas | 2000-06-27 |
| 6071559 | Dustfree prepreg and method for making an article based thereon | Bernd Karl Appelt, William Thomas Fotorny, Robert M. Japp, Kostantinos Papathomas | 2000-06-06 |
| 5928970 | Dustfree prepreg and method for making an article based thereon | Bernd Karl Appelt, William Thomas Fotorny, Robert M. Japp, Kostantinos Papathomas | 1999-07-27 |
| 5888850 | Method for providing a protective coating and electronic package utilizing same | Ross Downey Havens, Robert M. Japp, Jeffrey Alan Knight, Anne Marie Quinn | 1999-03-30 |
| 5800874 | Technique for forming resin-impregnated fiberglass sheets | Bernd Karl Appelt, William Thomas Fotorny, Robert M. Japp, Kostantinos Papathomas | 1998-09-01 |
| 5783252 | Technique for forming resin-impregnated fiberglass sheets | Bernd Karl Appelt, William Thomas Fotorny, Robert M. Japp, Kostantinos Papathomas | 1998-07-21 |
| 5773132 | Protecting copper dielectric interface from delamination | Lawrence Robert Blumberg, William T. Chen | 1998-06-30 |
| 5773371 | Technique for forming resin-impregnated fiberglass sheets | Bernd Karl Appelt, William Thomas Fotorny, Robert M. Japp, Kostantinos Papathomas | 1998-06-30 |
| 5756405 | Technique for forming resin-impregnated fiberglass sheets | Bernd Karl Appelt, William Thomas Fotorny, Robert M. Japp, Kostantinos Papathomas | 1998-05-26 |
| 5194930 | Dielectric composition and solder interconnection structure for its use | Kostas Papathomas, David W. Wang, Frederick R. Christie | 1993-03-16 |