Issued Patents All Time
Showing 1–25 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11331019 | Nanoparticle sensor having a nanofibrous membrane scaffold | Chuan-Jian Zhong, Benjamin S. Hsiao, Ning Kang, Shan Yan, Jing Li +2 more | 2022-05-17 |
| 10064283 | Embedded thin films | Junghyun Cho, Bahgat Sammakia, Roy H. Magnuson, Biplab K. Roy | 2018-08-28 |
| 9835737 | Autonomous gamma, X-ray, and particle detector | Steve Czarnecki, Andrzej Krol, Krishna C. Mandal, C. Ross Schmidtlein, Michael Thompson +1 more | 2017-12-05 |
| 9606245 | Autonomous gamma, X-ray, and particle detector | Steve Czarnecki, Andrzej Krol, Krishna C. Mandal, C. Ross Schmidtlein, Michael Thompson +1 more | 2017-03-28 |
| 8882983 | Embedded thin films | Junghyun Cho, Bahgat Sammakia, Roy H. Magnuson, Biplab K. Roy | 2014-11-11 |
| 8685284 | Conducting paste for device level interconnects | Rabindra N. Das, Roy H. Magnuson, Voya R. Markovich | 2014-04-01 |
| 8288857 | Anti-tamper microchip package based on thermal nanofluids or fluids | Rabindra N. Das, Voya R. Markovich, James J. McNamara, Jr. | 2012-10-16 |
| 8211790 | Multilayered circuitized substrate with P-aramid dielectric layers and method of making same | Robert M. Japp, Voya R. Markovich, Kostas Papathomas | 2012-07-03 |
| 8084863 | Circuitized substrate with continuous thermoplastic support film dielectric layers | Robert M. Japp, Voya R. Markovich, Kostas Papathomas | 2011-12-27 |
| 7981245 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Donald S. Farquhar, Voya R. Markovich, Douglas O. Powell | 2011-07-19 |
| 7777136 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Donald S. Farquhar, Voya R. Markovich, Douglas O. Powell | 2010-08-17 |
| 7713767 | Method of making circuitized substrate with internal optical pathway using photolithography | Benson Chan, How T. Lin, Roy H. Magnuson, Voya R. Markovich | 2010-05-11 |
| 7646098 | Multilayered circuitized substrate with p-aramid dielectric layers and method of making same | Robert M. Japp, Voya R. Markovich, Kostas Papathomas | 2010-01-12 |
| 7541058 | Method of making circuitized substrate with internal optical pathway | Benson Chan, How T. Lin, Roy H. Magnuson, Voya R. Markovich | 2009-06-02 |
| 7541265 | Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate | Rabindra N. Das, John M. Lauffer, Kostas Papathomas | 2009-06-02 |
| 7402254 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Donald S. Farquhar, Konstantinos I. Papathomas | 2008-07-22 |
| 7301108 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Donald S. Farquhar, Voya R. Markovich, Douglas O. Powell | 2007-11-27 |
| 7025607 | Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate | Rabindra N. Das, John M. Lauffer, Voya R. Markovich | 2006-04-11 |
| 7014731 | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Donald S. Farquhar, Konstantinos I. Papathomas | 2006-03-21 |
| 6967705 | Lamination of liquid crystal polymer dielectric films | Donald S. Farquhar | 2005-11-22 |
| 6944946 | Porous power and ground planes for reduced PCB delamination and better reliability | Robert M. Japp | 2005-09-20 |
| 6929900 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Donald S. Farquhar, Claudius Feger, Voya R. Markovich, Konstantinos I. Papathomas, Jane M. Shaw +2 more | 2005-08-16 |
| 6826830 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Donald S. Farquhar, Voya R. Markovich, Douglas O. Powell | 2004-12-07 |
| 6819373 | Lamination of liquid crystal polymer dielectric films | Donald S. Farquhar | 2004-11-16 |
| 6722031 | Method for making printed circuit board having low coefficient of thermal expansion power/ground plane | Robert M. Japp | 2004-04-20 |