LH

Louis L. Hsu

IBM: 466 patents #26 of 70,183Top 1%
Infineon Technologies Ag: 9 patents #2,021 of 7,486Top 30%
SA Siemens Aktiengesellschaft: 3 patents #4,667 of 22,248Top 25%
IT ITRI: 2 patents #3,461 of 9,619Top 40%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
📍 Taipei, NY: #1 of 76 inventorsTop 2%
Overall (All Time): #439 of 4,157,543Top 1%
471
Patents All Time

Issued Patents All Time

Showing 176–200 of 471 patents

Patent #TitleCo-InventorsDate
7112502 Method to fabricate passive components using conductive polymer Lawrence A. Clevenger, Carl Radens, Li-Kong Wang, Kwong Hon Wong 2006-09-26
7113006 Capacitor reliability for multiple-voltage power supply systems Rajiv V. Joshi, Jack A. Mandelman 2006-09-26
7102392 Signal detector for high-speed serdes Karl D. Selander, Michael A. Sorna 2006-09-05
7098070 Device and method for fabricating double-sided SOI wafer scale package with through via connections Howard H. Chen 2006-08-29
7093171 Flexible row redundancy system Gregory J. Fredeman, Rajiv V. Joshi, Toshiaki Kirihata 2006-08-15
7092235 Method for adjusting capacitance of an on-chip capacitor Lawrence A. Clevenger, Timothy J. Dalton, Carl Radens, Keith Kwong Hon Wong, Chih-Chao Yang 2006-08-15
7088074 System level device for battery and integrated circuit integration Lawrence A. Clevenger, Carl Radens, Li-Kong Wang, Kwong Hon Wong 2006-08-08
7087948 Forming electronic structures having dual dielectric thicknesses and the structure so formed Jack A. Mandelman, Carl Radens, Richard Strub, William R. Tonti 2006-08-08
7086020 Circuits and methods for matching device characteristics for analog and mixed-signal designs Howard H. Chen, Charlie C. Hwang 2006-08-01
7081842 Electronic component value trimming systems Hayden C. Cranford, Jr., James S. Mason, Gareth John Nicholls, Philip J. Murfet, Samuel T. Ray 2006-07-25
7057866 System and method for disconnecting a portion of an integrated circuit Rajiv V. Joshi, Chorng-Lii Hwang, Toshiaki Kirihata, Paul C. Parries 2006-06-06
7052937 Method and structure for providing improved thermal conduction for silicon semiconductor devices Lawrence A. Clevenger, Li-Kong Wang, Tsorng-Dih Yuan 2006-05-30
7041552 Integrated metal-insulator-metal capacitor and metal gate transistor Lawrence A. Clevenger, Kwong Hon Wong 2006-05-09
7041525 Three-dimensional island pixel photo-sensor Lawrence A. Clevenger, Carl Radens, Li-Kong Wang, Kwong Hon Wong 2006-05-09
7038319 Apparatus and method to reduce signal cross-talk Patrick H. Buffet, Charles S. Chiu, Jon Garlett, Brian J. Schuh 2006-05-02
7029956 Memory system capable of operating at high temperatures and method for fabricating the same Li-Kong Wang 2006-04-18
7029951 Cooling system for a semiconductor device and method of fabricating same Howard H. Chen, Joseph F. Shepard, Jr. 2006-04-18
7023528 Hybrid electronic mask Carl Radens, Li-Kong Wang, Kwong Hon Wong 2006-04-04
7018916 Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber George C. Feng, Rajiv V. Joshi 2006-03-28
7005319 Global planarization of wafer scale package with precision die thickness control Howard H. Chen, Brian L. Ji 2006-02-28
6994903 Hybrid substrate and method for fabricating the same Li-Kong Wang 2006-02-07
6992917 Integrated circuit with reduced body effect sensitivity William R. Dachtera, Rajiv V. Joshi 2006-01-31
6980824 Method and system for optimizing transmission and reception power levels in a communication system Brian L. Ji, Karl D. Selander, Michael A. Sorna 2005-12-27
6967416 Shared on-chip decoupling capacitor and heat-sink devices Lawrence A. Clevenger, Amy Hsu, Kwong Hon Wong 2005-11-22
6964892 N-channel metal oxide semiconductor (NMOS) driver circuit and method of making same Lawrence A. Clevenger, Rama Divakaruni, Yujun Li 2005-11-15