LH

Louis L. Hsu

IBM: 466 patents #26 of 70,183Top 1%
Infineon Technologies Ag: 9 patents #2,021 of 7,486Top 30%
SA Siemens Aktiengesellschaft: 3 patents #4,667 of 22,248Top 25%
IT ITRI: 2 patents #3,461 of 9,619Top 40%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
📍 Taipei, NY: #1 of 76 inventorsTop 2%
Overall (All Time): #439 of 4,157,543Top 1%
471
Patents All Time

Issued Patents All Time

Showing 126–150 of 471 patents

Patent #TitleCo-InventorsDate
7471101 Systems and methods for controlling of electro-migration Hayden C. Cranford, Jr., James S. Mason, Chih-Chao Yang 2008-12-30
7460003 Electronic fuse with conformal fuse element formed over a freestanding dielectric spacer Jack A. Mandelman, William R. Tonti, Chih-Chao Yang 2008-12-02
7447273 Redundancy structure and method for high-speed serial link Carl Radens, Li-Kong Wang 2008-11-04
7442579 Methods to achieve precision alignment for wafer scale packages Howard H. Chen 2008-10-28
7439108 Coplanar silicon-on-insulator (SOI) regions of different crystal orientations and methods of making the same Jack A. Mandelman 2008-10-21
7412211 Method for implementing enhanced hand shake protocol in microelectronic communication systems Jack A. Mandelman, James S. Mason 2008-08-12
7408374 Systems and methods for controlling of electro-migration Hayden C. Cranford, Jr., James S. Mason, Chih-Chao Yang 2008-08-05
7408269 Multi-level power supply system for a complementary metal oxide semiconductor circuit Rajiv V. Joshi 2008-08-05
7405982 Methods to improve the operation of SOI devices Roy C. Flaker, Jente B. Kuang 2008-07-29
7405108 Methods for forming co-planar wafer-scale chip packages Lloyd Burrell, Howard H. Chen, Wolfgang Sauter 2008-07-29
7404113 Flexible row redundancy system Gregory J. Fredeman, Rajiv V. Joshi, Toshiaki Kirihata 2008-07-22
7399686 Method and apparatus for making coplanar dielectrically-isolated regions of different semiconductor materials on a substrate Howard H. Chen, Jack A. Mandelman 2008-07-15
7397261 Monitoring system for detecting and characterizing classes of leakage in CMOS devices Edward R. Pillai, Joseph Natonio, James D. Rockrohr, David R. Hanson 2008-07-08
7396762 Interconnect structures with linear repair layers and methods for forming such interconnection structures Jack A. Mandelman, William R. Tonti, Chih-Chao Yang 2008-07-08
7394283 CML to CMOS signal converter Gautam Gangasani, Michael A. Sorna, Steven J. Zier 2008-07-01
7394273 On-chip electromigration monitoring system Hayden C. Cranford, Jr., Oleg Gluschenkov, James S. Mason, Michael A. Sorna, Chih-Chao Yang 2008-07-01
7393730 Coplanar silicon-on-insulator (SOI) regions of different crystal orientations and methods of making the same Jack A. Mandelman 2008-07-01
7384838 Semiconductor FinFET structures with encapsulated gate electrodes and methods for forming such semiconductor FinFET structures Jack A. Mandelman 2008-06-10
7381594 CMOS compatible shallow-trench efuse structure and method Jack A. Mandelman, William R. Tonti, Chih-Chao Yang 2008-06-03
7378853 System and method for detecting cable faults for high-speed transmission link Harry I. Linzer, James D. Rockrohr, Huihao Xu 2008-05-27
7369410 Apparatuses for dissipating heat from semiconductor devices Howard H. Chen, Hsichang Liu, Lawrence S. Mok 2008-05-06
7365001 Interconnect structures and methods of making thereof Chih-Chao Yang, Keith Kwong Hon Wong, Timothy J. Dalton, Carl Radens, Larry Clevenger 2008-04-29
7358164 Crystal imprinting methods for fabricating substrates with thin active silicon layers Jack A. Mandelman, William R. Tonti 2008-04-15
7355872 Segmented content addressable memory architecture for improved cycle time and reduced power consumption Brian L. Ji, Li-Kong Wang 2008-04-08
7348648 Interconnect structure with a barrier-redundancy feature Chih-Chao Yang 2008-03-25