HY

Haining Yang

IBM: 198 patents #164 of 70,183Top 1%
QU Qualcomm: 49 patents #499 of 12,104Top 5%
Micron: 14 patents #1,151 of 6,345Top 20%
CM Chartered Semiconductor Manufacturing: 4 patents #148 of 840Top 20%
Infineon Technologies Ag: 3 patents #2,452 of 7,486Top 35%
Samsung: 2 patents #37,631 of 75,807Top 50%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
UH University Of Hawaii: 2 patents #65 of 367Top 20%
CL Cambridge Enterprise Limited: 2 patents #106 of 688Top 20%
Huawei: 1 patents #8,196 of 15,535Top 55%
RU Rice University: 1 patents #21 of 77Top 30%
NU New York University: 1 patents #708 of 1,640Top 45%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
📍 San Diego, CA: #74 of 23,606 inventorsTop 1%
🗺 California: #277 of 386,348 inventorsTop 1%
Overall (All Time): #1,575 of 4,157,543Top 1%
276
Patents All Time

Issued Patents All Time

Showing 101–125 of 276 patents

Patent #TitleCo-InventorsDate
8159009 Semiconductor device having strain material 2012-04-17
8133810 Structure for metal cap applications Chih-Chao Yang, Daniel C. Edelstein, Keith Kwong Hon Wong 2012-03-13
8129842 Enhanced interconnect structure Chih-Chao Yang, Mukta G. Farooq, Keith Kwong Hon Wong 2012-03-06
8093644 Multiwalled carbon nanotube memory device 2012-01-10
8083958 Patterning method using a combination of photolithography and copolymer self-assemblying lithography techniques Wai-Kin Li 2011-12-27
8013419 Structure and method to form dual silicide e-fuse Deok-kee Kim, Ahmet S. Ozcan 2011-09-06
8008724 Structure and method to enhance both nFET and pFET performance using different kinds of stressed layers Bruce B. Doris, Huilong Zhu 2011-08-30
7984408 Structures incorporating semiconductor device structures with reduced junction capacitance and drain induced barrier lowering Kangguo Cheng, Louis L. Hsu, Jack A. Mandelman 2011-07-19
7973409 Hybrid interconnect structure for performance improvement and reliability enhancement Chih-Chao Yang, Thomas M. Shaw, Keith Kwong Hon Wong 2011-07-05
7968910 Complementary field effect transistors having embedded silicon source and drain regions Xiangdong Chen, Thomas W. Dyer 2011-06-28
7964487 Carrier mobility enhanced channel devices and method of manufacture Kangguo Cheng 2011-06-21
7960223 Structure and method to integrate dual silicide with dual stress liner to improve CMOS performance Xiangdong Chen 2011-06-14
7955952 Crackstop structures and methods of making same Xiao Hu Liu, Chih-Chao Yang 2011-06-07
7951714 High aspect ratio electroplated metal feature and method Daniel C. Edelstein, Keith Kwong Hon Wong, Chih-Chao Yang 2011-05-31
7947557 Heterojunction tunneling field effect transistors, and methods for fabricating the same Xiangdong Chen 2011-05-24
7943452 Gate conductor structure Wai-Kin Li 2011-05-17
7943454 Method for dual stress liner Xiangdong Chen 2011-05-17
7935993 Semiconductor device structure having enhanced performance FET device Xiangdong Chen 2011-05-03
7928443 Method and structure for forming strained SI for CMOS devices An Steegen, Ying Zhang 2011-04-19
7915691 High density SRAM cell with hybrid devices Robert C. Wong 2011-03-29
7892899 Hybrid orientation substrate and method for fabrication thereof Henry K. Utomo, Judson R. Holt 2011-02-22
7884448 High performance 3D FET structures, and methods for forming the same using preferential crystallographic etching Thomas W. Dyer 2011-02-08
7871895 Method and structure for relieving transistor performance degradation due to shallow trench isolation induced stress Ramachandra Divakaruni, Wai-Kin Li 2011-01-18
7868461 Embedded interconnects, and methods for forming same Thomas W. Dyer 2011-01-11
7867893 Method of forming an SOI substrate contact Ramachandra Divakaruni, Byeong Y. Kim, Junedong Lee, Gaku Sudo 2011-01-11