DS

Devendra K. Sadana

IBM: 797 patents #8 of 70,183Top 1%
Globalfoundries: 22 patents #130 of 4,424Top 3%
KT King Abdulaziz City For Science And Technology: 14 patents #6 of 573Top 2%
BC Bay Zu Precision Co.: 7 patents #1 of 12Top 9%
EC Egypt Nanotechnology Center: 3 patents #12 of 29Top 45%
MT Matheson Tri-Gas: 3 patents #10 of 47Top 25%
HL Hefechip Corporation Limited: 2 patents #10 of 16Top 65%
GU George Washington University: 2 patents #62 of 325Top 20%
NV NVIDIA: 1 patents #4,316 of 7,811Top 60%
ET Elpis Technologies: 1 patents #31 of 121Top 30%
IM International Machines: 1 patents #1 of 34Top 3%
MIT: 1 patents #4,386 of 9,367Top 50%
TC Toshiba America Electronic Components: 1 patents #23 of 77Top 30%
UE US Dept of Energy: 1 patents #1,355 of 5,099Top 30%
📍 Pleasantville, NY: #1 of 229 inventorsTop 1%
🗺 New York: #7 of 115,490 inventorsTop 1%
Overall (All Time): #99 of 4,157,543Top 1%
826
Patents All Time

Issued Patents All Time

Showing 751–775 of 826 patents

Patent #TitleCo-InventorsDate
7304328 Use of hydrogen implantation to improve material properties of silicon-germanium-on-insulator material made by thermal diffusion Stephen W. Bedell, Keith E. Fogel 2007-12-04
7285473 Method for fabricating low-defect-density changed orientation Si Joel Pereira de Souza, Keith E. Fogel, John A. Ott, Katherine L. Saenger 2007-10-23
7282425 Structure and method of integrating compound and elemental semiconductors for high-performance CMOS Steven J. Koester, Ghavam G. Shahidi 2007-10-16
7253034 Dual SIMOX hybrid orientation technology (HOT) substrates Kevin K. Chan, Joel P. de Souza, Alexander Reznicek, Katherine L. Saenger 2007-08-07
7247569 Ultra-thin Si MOSFET device structure and method of manufacture Diane C. Boyd, Bruce B. Doris, Meikei Ieong 2007-07-24
7247546 Method of forming strained silicon materials with improved thermal conductivity Stephen W. Bedell, Huajie Chen, Keith E. Fogel, Ryan Mitchell 2007-07-24
7172930 Strained silicon-on-insulator by anodization of a buried p+ silicon germanium layer Thomas N. Adam, Stephen W. Bedell, Joel P. de Souza, Keith E. Fogel, Alexander Reznicek +1 more 2007-02-06
7169226 Defect reduction by oxidation of silicon Stephen W. Bedell, Huajie Chen, Anthony G. Domenicucci, Keith E. Fogel 2007-01-30
7141115 Method of producing silicon-germanium-on-insulator material using unstrained Ge-containing source layers Stephen W. Bedell, Keith E. Fogel 2006-11-28
7141457 Method to form Si-containing SOI and underlying substrate with different orientations Meikei Ieong, Ghavam G. Shahidi 2006-11-28
7125458 Formation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer Stephen W. Bedell, Kwang Su Choe, Keith E. Fogel 2006-10-24
7115463 Patterning SOI with silicon mask to create box at different depths Dominic J. Schepis, Michael D. Steigerwalt 2006-10-03
7087965 Strained silicon CMOS on hybrid crystal orientations Kevin K. Chan, Meikei Ieong, Alexander Reznicek, Leathen Shi, Min Yang 2006-08-08
7084460 Method for fabricating SiGe-on-insulator (SGOI) and Ge-on-insulator (GOI) substrates Tze-Chiang Chen, Guy M. Cohen, Alexander Reznicek, Ghavam G. Shahidi 2006-08-01
7084050 Formation of silicon-germanium-on-insulator (SGOI) by an integral high temperature SIMOX-Ge interdiffusion anneal Stephen W. Bedell, Joel P. de Souza, Keith E. Fogel, Ghavam G. Shahidi 2006-08-01
7074686 Method of creating high-quality relaxed SiGe-on-insulator for strained Si CMOS applications Stephen W. Bedell, Jack O. Chu, Keith E. Fogel, Steven J. Koester 2006-07-11
7075150 Ultra-thin Si channel MOSFET using a self-aligned oxygen implant and damascene technique Diane C. Boyd, Bruce B. Doris, Meikei Ieong 2006-07-11
7067371 Silicon-on-insulator (SOI) integrated circuit (IC) chip with the silicon layers consisting of regions of different thickness Tak H. Ning 2006-06-27
7049660 High-quality SGOI by oxidation near the alloy melting temperature Stephen W. Bedell, Anthony G. Domenicucci, Keith E. Fogel 2006-05-23
7026249 SiGe lattice engineering using a combination of oxidation, thinning and epitaxial regrowth Stephen W. Bedell, Huajie Chen, Keith E. Fogel 2006-04-11
6991998 Ultra-thin, high quality strained silicon-on-insulator formed by elastic strain transfer Stephen W. Bedell, Anthony G. Domenicucci, Keith E. Fogel, Effendi Leobandung 2006-01-31
6989058 Use of thin SOI to inhibit relaxation of SiGe layers Stephen W. Bedell, Huajie Chen, Keith E. Fogel 2006-01-24
6967376 Divot reduction in SIMOX layers Stephen Fox, Neena Garg, Kenneth J. Giewont, Junedong Lee 2005-11-22
6958286 Method of preventing surface roughening during hydrogen prebake of SiGe substrates Huajie Chen, Dan M. Mocuta, Richard J. Murphy, Stephan W. Bedell 2005-10-25
6946373 Relaxed, low-defect SGOI for strained Si CMOS applications Paul D. Agnello, Stephen W. Bedell, Robert H. Dennard, Anthony G. Domenicucci, Keith E. Fogel 2005-09-20