Issued Patents All Time
Showing 26–50 of 102 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7144754 | Device having resin package and method of producing the same | Yoshiyuki Yoneda, Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto +1 more | 2006-12-05 |
| 6881611 | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device | Norio Fukasawa, Toshimi Kawahara, Muneharu Morioka, Mitsunada Osawa, Yasuhiro Shinma +6 more | 2005-04-19 |
| 6856017 | Device having resin package and method of producing the same | Yoshiyuki Yoneda, Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto +1 more | 2005-02-15 |
| 6696754 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Toshimi Kawahara, Toshio Hamano +5 more | 2004-02-24 |
| 6573121 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Toshimi Kawahara +3 more | 2003-06-03 |
| 6566999 | Anti-collision support system and method for automotive vehicle | Masahiko Iwasaki, Mitsuaki Hagino | 2003-05-20 |
| 6528346 | Bump-forming method using two plates and electronic device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +4 more | 2003-03-04 |
| 6495773 | Wire bonded device with ball-shaped bonds | Ryuji Nomoto, Kazuto Tsuji, Mitsutaka Sato | 2002-12-17 |
| 6476503 | Semiconductor device having columnar electrode and method of manufacturing same | Kazuyuki Imamura, Yasunori Fujimoto, Masaaki Seki, Tetsuya Fujisawa, Mitsutaka Sato +3 more | 2002-11-05 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Toshimi Kawahara, Toshio Hamano +5 more | 2002-10-29 |
| 6379997 | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | Toshimi Kawahara, Sinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiquro +3 more | 2002-04-30 |
| 6376921 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Toshimi Kawahara +3 more | 2002-04-23 |
| 6207477 | Semiconductor device having a ball grid array and a fabrication process thereof | Toshiyuki Motooka, Yoshiyuki Yoneda, Ryuji Nomoto, Toshimi Kawahara | 2001-03-27 |
| 6111306 | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | Toshimi Kawahara, Sinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiguro +3 more | 2000-08-29 |
| 6104160 | Household power supply system using electric vehicle | Kazurou Iwata, Hideaki Horie, Masaaki Taniguchi, Masahiko Teramoto, Hirokazu Hirano | 2000-08-15 |
| 6090301 | Method for fabricating bump forming plate member | Masataka Mizukoshi, Ichiro Yamaguchi, Masahiro Yoshikawa, Koki Otake | 2000-07-18 |
| 6072239 | Device having resin package with projections | Yoshiyuki Yoneda, Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto +1 more | 2000-06-06 |
| 6034428 | Semiconductor integrated circuit device having stacked wiring and insulating layers | Toshimi Kawahara, Hiroyuki Ishiguro, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi +2 more | 2000-03-07 |
| 6025650 | Semiconductor device including a frame terminal | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuuji Nomoto, Eiji Watanabe +2 more | 2000-02-15 |
| 6025258 | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +4 more | 2000-02-15 |
| 6022759 | Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit | Masaaki Seki, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Lim Cheang Hai +5 more | 2000-02-08 |
| 5889333 | Semiconductor device and method for manufacturing such | Masashi Takenaka, Masataka Mizukoshi, Taturou Yamashita | 1999-03-30 |
| 5861669 | Semiconductor package for surface mounting | Michio Sono, Masanori Yoshimoto, Kazuto Tsuji, Kouji Saito | 1999-01-19 |
| 5842628 | Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method | Ryuji Nomoto, Kazuto Tsuji, Mitsutaka Sato | 1998-12-01 |
| 5831332 | Semiconductor package for surface mounting | Michio Sono, Masanori Yoshimoto, Kazuto Tsuji, Kouji Saito | 1998-11-03 |