Issued Patents All Time
Showing 51–75 of 102 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5804467 | Semiconductor device and method of producing the same | Toshimi Kawahara, Shinya Nakaseko, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi +2 more | 1998-09-08 |
| 5801439 | Semiconductor device and semiconductor device unit for a stack arrangement | Tetsuya Fujisawa, Mitsutaka Sato, Masataka Mizukoshi, Kosuke Otokita, Hiroshi Yoshimura +4 more | 1998-09-01 |
| 5786985 | Semiconductor device and semiconductor device unit | Norio Taniguchi, Kazuto Tsuji, Michio Sono, Masanori Yoshimoto, Katsuhiro Hayashida +5 more | 1998-07-28 |
| 5773313 | Semiconductor device and method of producing the same | Mitsutaka Sato | 1998-06-30 |
| 5760471 | Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package | Tetsuya Fujisawa, Mitsutaka Sato, Masataka Mizukoshi, Kousuke Otokita, Hiroshi Yoshimura +4 more | 1998-06-02 |
| 5750421 | Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device | Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo +2 more | 1998-05-12 |
| 5747874 | Semiconductor device, base member for semiconductor device and semiconductor device unit | Masaaki Seki, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Lim Cheang Hai +5 more | 1998-05-05 |
| 5736428 | Process for manufacturing a semiconductor device having a stepped encapsulated package | Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo +2 more | 1998-04-07 |
| 5684675 | Semiconductor device unit having holder | Norio Taniguchi, Kazuto Tsuji, Michio Sono, Masanori Yoshimoto | 1997-11-04 |
| 5679978 | Semiconductor device having resin gate hole through substrate for resin encapsulation | Toshimi Kawahara, Shinya Nakaseko, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi +2 more | 1997-10-21 |
| 5666064 | Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device | Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo +2 more | 1997-09-09 |
| 5643831 | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +6 more | 1997-07-01 |
| 5637923 | Semiconductor device, carrier for carrying semiconductor device | Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma | 1997-06-10 |
| 5637915 | Semiconductor device affixed to an upper and a lower leadframe | Mitsutaka Sato, Masanori Yoshimoto, Kouichi Takeshita | 1997-06-10 |
| 5574310 | Semiconductor package for surface mounting with reinforcing members on support legs | Michio Sono, Masanori Yoshimoto, Kazuto Tsuji, Kouji Saito | 1996-11-12 |
| 5569625 | Process for manufacturing a plural stacked leadframe semiconductor device | Yoshiyuki Yoneda, Kazuto Tsuji, Hideharu Sakoda | 1996-10-29 |
| 5530292 | Semiconductor device having a plurality of chips | Masaki Waki, Tsuyoshi Aoki, Toshiyuki Honda, Hirotaka Sato | 1996-06-25 |
| 5521432 | Semiconductor device having improved leads comprising palladium plated nickel | Kazuto Tsuji, Yoshiyuki Yoneda, Michio Sono | 1996-05-28 |
| 5519251 | Semiconductor device and method of producing the same | Mitsutaka Sato | 1996-05-21 |
| 5508565 | Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package | Atsushi Hatakeyama, Fumio Baba, Mitsutaka Sato | 1996-04-16 |
| 5475259 | Semiconductor device and carrier for carrying semiconductor device | Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo +2 more | 1995-12-12 |
| 5463253 | Semiconductor device having a plurality of chips | Masaki Waki, Tsuyoshi Aoki, Toshiyuki Honda, Hirotaka Sato | 1995-10-31 |
| 5451815 | Semiconductor device with surface mount package adapted for vertical mounting | Norio Taniguchi, Kazuto Tsuji, Michio Sono | 1995-09-19 |
| 5440170 | Semiconductor device having a die pad with rounded edges and its manufacturing method | Kazuto Tsuji, Yoshiyuki Yoneda | 1995-08-08 |
| 5424251 | Method of producing semiconductor device having radiation part made of resin containing insulator powders | Michio Sono | 1995-06-13 |