Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
XF

Xinyu Fu

Applied Materials: 46 patents #183 of 7,310Top 3%
ANAnticancer: 3 patents #16 of 39Top 45%
Pleasanton, CA: #85 of 3,062 inventorsTop 3%
California: #7,669 of 386,348 inventorsTop 2%
Overall (All Time): #52,199 of 4,157,543Top 2%
51 Patents All Time

Issued Patents All Time

Showing 26–50 of 51 patents

Patent #TitleCo-InventorsDate
8951913 Method for removing native oxide and associated residue from a substrate Bo Zheng, Arvind Sundarrajan 2015-02-10
8927423 Methods for annealing a contact metal layer to form a metal silicidation layer Wei V. Tang, Kavita Shah, Srinivas Gandikota, San Yu, Avgerinos V. Gelatos 2015-01-06
8871064 Electromagnet array in a sputter reactor Tza-Jing Gung, Arvind Sundarrajan, Edward P. Hammond, IV, Praburam Gopalraja, John C. Forster +2 more 2014-10-28
8852674 Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layers Jick Yu 2014-10-07
8772162 Method for removing native oxide and associated residue from a substrate Bo Zheng, Arvind Sundarrajan 2014-07-08
8765601 Post deposition treatments for CVD cobalt films Yu Lei, Anantha K. Subramani, Seshadri Ganguli, Srinivas Gandikota 2014-07-01
8637410 Method for metal deposition using hydrogen plasma Anantha K. Subramani, John C. Forster, Seshadri Ganguli, Michael S. Jackson, Xinliang Lu +2 more 2014-01-28
8586479 Methods for forming a contact metal layer in semiconductor devices Srinivas Gandikota, Sang Ho Yu, Kavita Shah, Yu Lei 2013-11-19
8580354 Plasma treatment of substrates prior to deposition Jick Yu 2013-11-12
8580630 Methods for forming a metal gate structure on a substrate Jianxin Lei, Srinivas Gandikota, Jian Z. Ren 2013-11-12
8524600 Post deposition treatments for CVD cobalt films Yu Lei, Anantha K. Subramani, Seshadri Ganguli, Srinivas Gandikota 2013-09-03
8455352 Method for removing native oxide and associated residue from a substrate Bo Zheng, Arvind Sundarrajan 2013-06-04
8349724 Method for improving electromigration lifetime of copper interconnection by extended post anneal Jick Yu 2013-01-08
8168543 Methods of forming a layer for barrier applications in an interconnect structure Keyvan Kashefizadeh, Ashish Bodke, Winsor Lam, Yiochiro Tanaka, Wonwoo Kim 2012-05-01
8021514 Remote plasma source for pre-treatment of substrates prior to deposition Jick Yu 2011-09-20
7807568 Methods for reducing damage to substrate layers in deposition processes Arvind Sundarrajan 2010-10-05
7704887 Remote plasma pre-clean with low hydrogen pressure John C. Forster, Jick Yu, Ajay Bhatnagar, Praburam Gopalraja 2010-04-27
7695567 Water vapor passivation of a wall facing a plasma 2010-04-13
7686926 Multi-step process for forming a metal barrier in a sputter reactor Tza-Jing Gung, Arvind Sundarrajan, Edward P. Hammond, IV, Praburam Gopalraja, John C. Forster +2 more 2010-03-30
7658802 Apparatus and a method for cleaning a dielectric film John C. Forster, Wei Wang 2010-02-09
7618521 Split magnet ring on a magnetron sputter chamber 2009-11-17
7618893 Methods of forming a layer for barrier applications in an interconnect structure Keyvan Kashefizadeh, Ashish Bodke, Winsor Lam, Yiochiro Tanaka, Wonwoo Kim 2009-11-17
7615489 Method for forming metal interconnects and reducing metal seed layer overhang 2009-11-10
RE39337 Nude mouse model for human neoplastic disease Ann Monosov 2006-10-10
5569812 Nude mouse model for human neoplastic disease Ann Monosov 1996-10-29