Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8168543 | Methods of forming a layer for barrier applications in an interconnect structure | Xinyu Fu, Keyvan Kashefizadeh, Ashish Bodke, Winsor Lam, Wonwoo Kim | 2012-05-01 |
| 7618893 | Methods of forming a layer for barrier applications in an interconnect structure | Xinyu Fu, Keyvan Kashefizadeh, Ashish Bodke, Winsor Lam, Wonwoo Kim | 2009-11-17 |