Issued Patents All Time
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7113009 | Programmable frequency divider | Bruce P. Del Signore, Axel Thomsen, Douglas F. Pastorello | 2006-09-26 |
| 7104869 | Barrier removal at low polish pressure | Stan Tsai, Rashid Mavliev, Feng Q. Liu, Liang-Yuh Chen, Ratson Morad | 2006-09-12 |
| 7077725 | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus | Stan Tsai, Fritz Redeker | 2006-07-18 |
| 7060606 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Shijian Li, Feng Q. Liu, Rashid Mavliev +2 more | 2006-06-13 |
| 7037174 | Methods for reducing delamination during chemical mechanical polishing | Yufei Chen, Doohan Lee, Wei-Yung Hsu | 2006-05-02 |
| 7022608 | Method and composition for the removal of residual materials during substrate planarization | Stan Tsai, Shijian Li | 2006-04-04 |
| 7012025 | Tantalum removal during chemical mechanical polishing | Stan Tsai, Shijian Li, Feng Q. Liu | 2006-03-14 |
| 7008554 | Dual reduced agents for barrier removal in chemical mechanical polishing | Stan Tsai, Shijian Li, Feng Q. Liu, Liang-Yuh Chen | 2006-03-07 |
| 6991526 | Control of removal profile in electrochemically assisted CMP | Liang-Yuh Chen, Siew Neo, Feng Q. Liu, Alain Duboust, Stan Tsai +1 more | 2006-01-31 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2005-11-08 |
| 6946884 | Fractional-N baseband frequency synthesizer in bluetooth applications | William Eric Holland, Wenzhe Luo, Zhigang Ma, Dale H. Nelson, Harold Simmonds +1 more | 2005-09-20 |
| 6899804 | Electrolyte composition and treatment for electrolytic chemical mechanical polishing | Alain Duboust, Feng Q. Liu, Yuchun Wang, Yan Wang, Siew Neo +1 more | 2005-05-31 |
| 6863797 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Feng Q. Liu, Siew Neo, Stan Tsai, Liang-Yuh Chen | 2005-03-08 |
| 6858540 | Selective removal of tantalum-containing barrier layer during metal CMP | Stan Tsai, Shijian Li, Fred C. Redeker | 2005-02-22 |
| 6821881 | Method for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Shijian Li, Feng Q. Liu, Rashid Mavliev +2 more | 2004-11-23 |
| 6776693 | Method and apparatus for face-up substrate polishing | Alain Duboust, Shou-Sung Chang, Liang-Yuh Chen, Yan Wang, Siew Neo +1 more | 2004-08-17 |
| 6739951 | Method and apparatus for electrochemical-mechanical planarization | Stan Tsai, Fred C. Redeker | 2004-05-25 |
| 6709316 | Method and apparatus for two-step barrier layer polishing | Stan Tsai, Shijian Li | 2004-03-23 |
| 6677239 | Methods and compositions for chemical mechanical polishing | Wei-Yung Hsu, Gopalakrishna B. Prabhu, Daniel Carl | 2004-01-13 |
| 6669538 | Pad cleaning for a CMP system | Shijian Li, Ramin Emami, Sen-Hou Ko, Shi-Ping Wang, Fred C. Redeker +1 more | 2003-12-30 |
| 6653242 | Solution to metal re-deposition during substrate planarization | Stan Tsai, Shijian Li, John M. White | 2003-11-25 |
| 6613200 | Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform | Shijian Li, Stan Tsai | 2003-09-02 |
| 6592742 | Electrochemically assisted chemical polish | Shijian Li | 2003-07-15 |
| 6552618 | VCO gain self-calibration for low voltage phase lock-loop applications | Dale H. Nelson | 2003-04-22 |
| 6541384 | Method of initiating cooper CMP process | Stan Tsai, Shijian Li, John M. White | 2003-04-01 |