Issued Patents All Time
Showing 76–92 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6143672 | Method of reducing metal voidings in 0.25 .mu.m AL interconnect | Minh Van Ngo, Suzette K. Pangrle, Robert A. Huertas | 2000-11-07 |
| 6140706 | Semiconductor device and method of manufacturing without damaging HSQ layer and metal pattern utilizing multiple dielectric layers | Fei Wang, Susan H. Chen | 2000-10-31 |
| 6124203 | Method for forming conformal barrier layers | Young-Chang Joo, Dirk Brown | 2000-09-26 |
| 6093635 | High integrity borderless vias with HSQ gap filled patterned conductive layers | Khanh Tran, Richard J. Huang, Lu You | 2000-07-25 |
| 6060380 | Antireflective siliconoxynitride hardmask layer used during etching processes in integrated circuit fabrication | Ramkumar Subramanian, Bhanwar Singh, Fei Wang | 2000-05-09 |
| 6043153 | Method for reducing electromigration in a copper interconnect | Takeshi Nogami | 2000-03-28 |
| 5994778 | Surface treatment of low-k SiOF to prevent metal interaction | Richard J. Huang, Guarionex Morales | 1999-11-30 |
| 5888898 | HSQ baking for reduced dielectric constant | Minh Van Ngo, Khanh Tran, Terri Jo Kitson, Lu You, Jean Y. Yang | 1999-03-30 |
| 5861677 | Low RC interconnection | Lu You, Robin Cheung, Richard J. Huang | 1999-01-19 |
| 5843836 | Tunneling technology for reducing intra-conductive layer capacitance | Robin Cheung, Richard J. Huang | 1998-12-01 |
| 5814560 | Metallization sidewall passivation technology for deep sub-half micrometer IC applications | Robin Cheung, Subhash Gupta | 1998-09-29 |
| 5760480 | Low RC interconnection | Lu You, Robin Cheung, Richard J. Huang | 1998-06-02 |
| 5670828 | Tunneling technology for reducing intra-conductive layer capacitance | Robin Cheung, Richard J. Huang | 1997-09-23 |
| 5288660 | Method for forming self-aligned t-shaped transistor electrode | Chang-Hwang Hua, Ding-Yuan S. Day | 1994-02-22 |
| 4978639 | Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips | Chang-Hwang Hua, Ding-Yuan S. Day, Adrian Lee | 1990-12-18 |
| 4842699 | Method of selective via-hole and heat sink plating using a metal mask | Chang-Hwang Hua, Ding-Yuan S. Day | 1989-06-27 |
| 4808273 | Method of forming completely metallized via holes in semiconductors | Chang-Hwang Hua, Ding-Yuan S. Day | 1989-02-28 |