Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11949008 | Semiconductor structure and method for forming the same | Chia-Hao CHEN | 2024-04-02 |
| 11177379 | Gate-sinking pHEMTs having extremely uniform pinch-off/threshold voltage | Chia-Ming Chang, Jung-Tao Chung, Ju-Hsien Lin, Yan-Cheng Lin, Yu-Chi Wang | 2021-11-16 |
| 10720390 | Ohmic metal structure for GaN device | Yi-Wei Lien | 2020-07-21 |
| 10410979 | Structure for reducing compound semiconductor wafer distortion | Wen Chu | 2019-09-10 |
| 10374129 | Compound semiconductors having an improved high temperature resistant backside metallization | Shu-Chen Chen, Huang-Wen Wang, Walter Tony Wohlmuth | 2019-08-06 |
| 10158212 | Structure for reducing compound semiconductor wafer distortion | Wen Chu | 2018-12-18 |
| 10096583 | Method for fabricating a semiconductor integrated chip | Shinichiro Takatani, Hsien-Fu Hsiao, Cheng-Kuo Lin | 2018-10-09 |
| 9704829 | Stacked structure of semiconductor chips having via holes and metal bumps | Chih-Hsien Lin | 2017-07-11 |
| 9673186 | Semiconductor integrated circuit | Shinichiro Takatani, Hsien-Fu Hsiao, Cheng-Kuo Lin | 2017-06-06 |
| 9548276 | Structure of backside copper metallization for semiconductor devices and a fabrication method thereof | Jason Chen, Wen Chu | 2017-01-17 |
| 9190374 | Structure of a semiconductor chip with substrate via holes and metal bumps and a fabrication method thereof | Chih-Hsien Lin | 2015-11-17 |
| 9178007 | High breakdown voltage metal-insulator-metal capacitor | Winson Shao, Ben Hsu, Wen Chu | 2015-11-03 |
| 8911551 | Electroless plating apparatus and method | Jason Chen, Nakano Liu, Winson Shao, Wen Chu | 2014-12-16 |
| 8835283 | Fabrication method for producing semiconductor chips with enhanced die strength | — | 2014-09-16 |
| 8497206 | Method of processing backside copper layer for semiconductor chips | Wen Chu | 2013-07-30 |
| 8033011 | Method for mounting a thinned semiconductor wafer on a carrier substrate | Jason Chou, Ping Wei CHEN, Sen Yang | 2011-10-11 |
| 8003532 | Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film | Wen Chu | 2011-08-23 |
| 5288660 | Method for forming self-aligned t-shaped transistor electrode | Simon S. Chan, Ding-Yuan S. Day | 1994-02-22 |
| 5127984 | Rapid wafer thinning process | Ding-Yuan S. Day | 1992-07-07 |
| 4978639 | Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips | Simon S. Chan, Ding-Yuan S. Day, Adrian Lee | 1990-12-18 |
| 4842699 | Method of selective via-hole and heat sink plating using a metal mask | Ding-Yuan S. Day, Simon S. Chan | 1989-06-27 |
| 4808273 | Method of forming completely metallized via holes in semiconductors | Ding-Yuan S. Day, Simon S. Chan | 1989-02-28 |