Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410979 | Structure for reducing compound semiconductor wafer distortion | Chang-Hwang Hua | 2019-09-10 |
| 10158212 | Structure for reducing compound semiconductor wafer distortion | Chang-Hwang Hua | 2018-12-18 |
| 9548276 | Structure of backside copper metallization for semiconductor devices and a fabrication method thereof | Jason Chen, Chang-Hwang Hua | 2017-01-17 |
| 9178007 | High breakdown voltage metal-insulator-metal capacitor | Chang-Hwang Hua, Winson Shao, Ben Hsu | 2015-11-03 |
| 8911551 | Electroless plating apparatus and method | Jason Chen, Nakano Liu, Winson Shao, Chang-Hwang Hua | 2014-12-16 |
| 8497206 | Method of processing backside copper layer for semiconductor chips | Chang-Hwang Hua | 2013-07-30 |
| 8003532 | Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film | Chang-Hwang Hua | 2011-08-23 |