Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287175 | Fabrication method for dicing of semiconductor wafers using laser cutting techniques | Chang-Huang HUA, Kevin Huang, Benny HO, Chen-Che CHIN | 2016-03-15 |
| 8033011 | Method for mounting a thinned semiconductor wafer on a carrier substrate | Jason Chou, Chang-Hwang Hua, Sen Yang | 2011-10-11 |