Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5288660 | Method for forming self-aligned t-shaped transistor electrode | Chang-Hwang Hua, Simon S. Chan | 1994-02-22 |
| 5127984 | Rapid wafer thinning process | Chang-Hwang Hua | 1992-07-07 |
| 4978639 | Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips | Chang-Hwang Hua, Simon S. Chan, Adrian Lee | 1990-12-18 |
| 4842699 | Method of selective via-hole and heat sink plating using a metal mask | Chang-Hwang Hua, Simon S. Chan | 1989-06-27 |
| 4808273 | Method of forming completely metallized via holes in semiconductors | Chang-Hwang Hua, Simon S. Chan | 1989-02-28 |