Issued Patents All Time
Showing 201–212 of 212 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6150285 | Method for simultaneous deposition and sputtering of TEOS | Minh Van Ngo | 2000-11-21 |
| 6110829 | Ultra-low temperature Al fill for sub-0.25 .mu.m generation of ICs using an Al-Ge-Cu alloy | Robin Cheung, Guarionex Morales | 2000-08-29 |
| 6100145 | Silicidation with silicon buffer layer and silicon spacers | Nick Kepler, Karsten Wieczorek, Larry Wang | 2000-08-08 |
| 6096599 | Formation of junctions by diffusion from a doped film into and through a silicide during silicidation | Nick Kepler, Karsten Wieczorek, Larry Wang | 2000-08-01 |
| 6046106 | High density plasma oxide gap filled patterned metal layers with improved electromigration resistance | Khanh Tran, Guarionex Morales, Shekhar Pramanick | 2000-04-04 |
| 5970370 | Manufacturing capping layer for the fabrication of cobalt salicide structures | Robin Cheung, Robert Chen | 1999-10-19 |
| 5936307 | Surface modification method for film stress reduction | Diana M. Schonauer, Subhash Gupta, Bhanwar Singh | 1999-08-10 |
| 5918149 | Deposition of a conductor in a via hole or trench | John A. Iacoponi, Roger Alvis | 1999-06-29 |
| 5789315 | Eliminating metal extrusions by controlling the liner deposition temperature | Robin Cheung | 1998-08-04 |
| 5738917 | Process for in-situ deposition of a Ti/TiN/Ti aluminum underlayer | Khanh Tran | 1998-04-14 |
| 5597458 | Method for producing alloy films using cold sputter deposition process | John Sanchez, Darin A. Chan | 1997-01-28 |
| 5582881 | Process for deposition of a Ti/TiN cap layer on aluminum metallization and apparatus | Raymond T. Lee, Khanh Tran | 1996-12-10 |