| 12144774 |
Spasticity assessment and rehabilitation support system for stroke patients using characteristic vector analysis |
Duk Shin |
2024-11-19 |
| 12132019 |
Packaged multi-chip semiconductor devices and methods of fabricating same |
Hyuekjae Lee, Jihoon Kim, Taehun Kim, Sangcheon Park, Jinkyeong Seol +1 more |
2024-10-29 |
| 12119306 |
Semiconductor package |
Ju-Il Choi, Gyuho Kang, Un-Byoung Kang, Byeongchan KIM, Junyoung Park +1 more |
2024-10-15 |
| 12113050 |
Semiconductor package with increased thermal radiation efficiency |
Sang-Sick Park, Un-Byoung Kang, Teak-Hoon Lee |
2024-10-08 |
| 12098493 |
Filter device and washing machine having same |
Youngjin Cho, Kanghyun LEE, Byoungyull YANG, Sanggyu JUNG |
2024-09-24 |
| 12096887 |
Blender and container for blender |
Hyunwoo Park, Kijoong Kang |
2024-09-24 |
| 12062639 |
Semiconductor package and method of fabricating the same |
Jaekyung Yoo, Yeongkwon Ko |
2024-08-13 |
| 12040294 |
Semiconductor devices and semiconductor packages including the same |
Ju-Il Choi, Un-Byoung Kang, Jin Ho An, Jeonggi Jin, Atsushi Fujisaki |
2024-07-16 |
| 12002726 |
Semiconductor package and method of manufacture |
Jinwoo Park, Yeongkwon Ko |
2024-06-04 |
| 11967581 |
Package structures having underfills |
Jinwoo Park, Unbyoung Kang, Teakhoon Lee |
2024-04-23 |
| 11939232 |
Water purifier |
Wanku KANG, Minkyu Kim, Junggeun LEE |
2024-03-26 |
| 11935873 |
Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips |
Joonho Jun, Un-Byoung Kang, Sunkyoung Seo, Young Kun Jee |
2024-03-19 |
| 11927700 |
Systems, methods, and media for improving signal-to-noise ratio in single-photon data |
Mohit Gupta |
2024-03-12 |
| 11889138 |
Systems, servers and methods of remotely providing media to a user terminal and managing information associated with the media |
Youngjin Cho |
2024-01-30 |
| 11874026 |
Air conditioner and control method therefor |
Jungsoo LIM, Kyoungmok KIM, Seulkiro Kim, Sunhee Park, Hyesoon Yang +4 more |
2024-01-16 |
| 11862603 |
Semiconductor packages with chips partially embedded in adhesive |
Taewook Kim, Jeongjoon Oh, Hyeon Hwang |
2024-01-02 |