Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183664 | Semiconductor package | Ju-Il Choi, Gyuho Kang, Seong-Hoon Bae, Jin Ho An, Atsushi Fujisaki | 2024-12-31 |
| 12142541 | Semiconductor package | Jumyong Park, Jinho An, Taehwa Jeong, Jinho Chun, Juil Choi +1 more | 2024-11-12 |
| 12040294 | Semiconductor devices and semiconductor packages including the same | Ju-Il Choi, Un-Byoung Kang, Jin Ho An, Jongho Lee, Atsushi Fujisaki | 2024-07-16 |
| 12027482 | Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip | Gyuho Kang, Unbyoung Kang, Heewon KIM, Jumyong Park, Hyunsu Hwang | 2024-07-02 |
| 12021034 | Semiconductor package and method of manufacturing the semiconductor package | Solji Song, Byeongchan KIM, Jumyong Park, Jinho An, Chungsun Lee +1 more | 2024-06-25 |
| 11996358 | Semiconductor packages having first and second redistribution patterns | Ju-Il Choi, Jumyong Park, Jin Ho An, Dongjoon Oh, Chungsun Lee +1 more | 2024-05-28 |
| 11984420 | Semiconductor device | Solji Song, Taehwa Jeong, Jinho Chun, Juil Choi, Atsushi Fujisaki | 2024-05-14 |
| 11978688 | Semiconductor device having via protective layer | Jumyong Park, Solji Song, Jinho An, Jinho Chun, Juil Choi | 2024-05-07 |