Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021034 | Semiconductor package and method of manufacturing the semiconductor package | Byeongchan KIM, Jumyong Park, Jinho An, Chungsun Lee, Jeonggi Jin +1 more | 2024-06-25 |
| 11984420 | Semiconductor device | Jeonggi Jin, Taehwa Jeong, Jinho Chun, Juil Choi, Atsushi Fujisaki | 2024-05-14 |
| 11978688 | Semiconductor device having via protective layer | Jumyong Park, Jinho An, Jeonggi Jin, Jinho Chun, Juil Choi | 2024-05-07 |