Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094847 | Semiconductor package and method of manufacturing the same | Seyeong SEOK, Un-Byoung Kang | 2024-09-17 |
| 12021034 | Semiconductor package and method of manufacturing the semiconductor package | Solji Song, Byeongchan KIM, Jumyong Park, Jinho An, Jeonggi Jin +1 more | 2024-06-25 |
| 12014977 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Ji-Seok Hong, Dongwoo Kim, Hyunah KIM, Un-Byoung Kang | 2024-06-18 |
| 12009288 | Interconnection structure and semiconductor package including the same | Dongjoon Oh, Junyun Kweon, Jumyong Park, Jin Ho An, Hyunsu Hwang | 2024-06-11 |
| 11996358 | Semiconductor packages having first and second redistribution patterns | Ju-Il Choi, Jumyong Park, Jin Ho An, Dongjoon Oh, Jeonggi Jin +1 more | 2024-05-28 |
| 11923309 | Semiconductor package including fine redistribution patterns | Hyunsu Hwang, Junyun Kweon, Jumyong Park, Jin Ho An, Dongjoon Oh +1 more | 2024-03-05 |